国家/地区 中国（5）
IPC部 C（5）
IPC大类 C08（5）
IPC小类 C08K（5）
IPC C08K009/06（5）
发明人
公开年 2021（3）
申请年 2020（2） 
专利权人

Heat-conducting gel used for heat dissipation of electronic device, comprises silicone oil matrix, bisphenol-A-type epoxy resin and heat-conducting filler comprising modified graphene, modified diamond and modified carbon nanotubes, where surface of modified graphene is modified with amino group.

HE Y, LIU F, YU G

Silicone resin composition used for composite material for heat conductive silicone sheet for electronic component, comprises silicone resin and heat resistance improving agent comprising organic polycyclic aromatic compound containing secondary amino groups and ketone groups in cyclic structure.

MAKOTO I, KATSUYUKI S, YUJI N, IWAI M, SUZUMURA K, NAKAJIMA Y, NAKASHIMA Y

Flexible heat-conducting insulating material used in electronic device, and preparing heat-dissipating plate and smart power module, comprises silicone oil, metal oxide and curing agent, where curing agent is hydrogen-contained silicone oil.

WANG X, FENG Y

Preparing heat-conducting and wave-absorbing integrated graphene thermal interface material comprises taking graphene oxide as carrier, compounding heat-conducting insulating material and magnetic insulating material.

YAO L, LIU Y, LIU M, ZHENG J

Processing boron fiber reinforced unsaturated resin sheet forming and stress measurement comprises e. g. forming graphene powder by modifying graphene with silane and adding graphene powder into acetone solution.

WANG A, LI J, NIU Q, LI S, LI N