国家/地区 中国（25）
IPC部 C（27）
IPC大类 C08（27）
IPC小类 C08L（27）
IPC C08L033/04（27）
发明人 GE X（2） LI F（2） LI Y（2）
LI Z（2） WANG G（2） ZHOU B（2）
公开年 2021（27）
申请年 2020（15）  2021（10）  2019（2） 
专利权人 HANGZHOU FUX.（2）

Preparing sound-absorbing conductive composite plate comprises e.g. obtaining preprocessed particles, carrying out vacuum pressure treatment, preparing foamed material, dispersion, three-dimensional graphene, large-scale graphene aerogel and sound-absorbing conductive core material and shaping.

ZHANG Q

Solvent-free synthetic material for ice and snow motion, comprises isocyanate prepolymer, hydroxyl alkyd resin, low temperature resistant polyester polyol, trifluoroethanol, hexafluoro butyl alcohol, and secondary amino compound.

CHEN P, WANG G

Anti-aging chemical barrel comprises polyethylene, silicone rubber, polyamide imide, polyacrylic acid ester, diisocyanate, graphene, titanic acid ester coupling agent, antioxidant, ultraviolet absorbent, 201 silicone oil and color masterbatch.

ZHANG W

Modified PTFE molded pipe material comprises fiber filler, toughening agent, antioxidant, and modified PTFE, where modified PTFE is prepared by connecting PTFE with electrode, introducing hydrogen and ammonia gas, pressurizing, processing, mixing with mixed resin and modified filler, and cleaning.

SHEN J, QIU H

Stone plastic composite floor comprises e.g. polyvinyl chloride resin, nano-calcium carbonate, lubricant, calcium-zinc stabilizer, microcrystalline cellulose, ultra-dispersant, tourmaline powder, carbon nanotube and bacteriostatic agent.

FANG Y

Preparing environmentally-friendly modified polyurethane photovoltaic cable with high weather resistance and cracking resistance involves using cable core, insulation layer and protective layer and extruding insulation layer pellet.

XIE H

Conductive packaging film useful in conductive packaging bag, comprises base material layer including e.g. polypropylene resin, phenolic resin, polyolefin and polyethylene resin, and conductive layer including e.g. carbon black powder.

SU Z, MENG Y

Preparing graphene microsphere used for preparing high-thermal-conductivity gasket, involves using graphene heat-conducting film and artificial graphite heat-conducting film as base material, and preparing graphene powder using crushing process, and preparing graphene microspheres by sol method.

LI F, GE X, LI Z, ZHOU B

Combination useful in laminate structure, comprises non-conductive polymer, filler and saline, where filler comprises material e.g. graphene, saline comprises acrylate polymer having wet end and dry end and wet end can bond with filler.

PU V D

Graphene composite foam film comprises graphene foam film and a high polymer and the graphene foam film provided with pores and high polymer distributed in the pores on the surface of the graphene foam film.

GE X, LI F, LI Z, SHI Y, ZHOU B