国家/地区 中国（8）
IPC部 B（8）
IPC大类 B32（8）
IPC小类 B32B（8）
IPC C08L063/00（8）
发明人 CHEN K（2） YU D（2）
公开年 2022（2）
申请年 2020（3） 
专利权人 ITEQ WUXI EL.（2）

Foam electromagnetic shielding material with bulletproof function used in stealth airplanes, is prepared by superposing coated aramid fiber laid fabric blocks to obtain bulletproof aramid fiber chips to obtain foam electromagnetic shielding material precursor, and heating.

FU L, PAN Z, WU Z, LIU Y, FANG X, CUI Z, LI Z, XU D, AI Q, HU L, LI N, CHEN H

Low-expansion coefficient halogen-free resin composition useful in laminate for printed circuit board, comprises e.g. o-cresol formaldehyde epoxy resin, bismaleimide resin, cyanate ester hardener and bisphenol A type 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide hardener.

CHEN K, YU D

Halogen-free low-dielectric epoxy resin composition useful in laminated plate and printed circuit board, comprises e.g. dicyclopentadiene epoxy resin, cresol novolac epoxy resin, maleimide resin, and 9,10-dihydro-9-oxa-10-phosphaphenan-threne-10-oxide-bisphenol phenolic resin hardener.

CHEN K, YU D

Flexible metal-based graphene electric heating material, comprises flexible insulating layer, flexible graphene resistance layer, flexible insulating layer, and metal substrate arranged sequentially from top to bottom.

LI Y, LOU M

Graphene electric heating film comprises upper protective layer, graphene electric heating layer, insulation layer and lower protective layer, where graphene electric heating layer comprises base layer and graphene coating.

XU J

Preparing thermal-insulating graphene electrothermal film by mixing and heating silicone acrylic emulsion and aqueous-based fluorocarbon emulsion, and coating one side of thermal insulation bottom layer with graphene electrothermal film.

HUANG Z, XIA Y, LIU J, JIANG J

Thermosetting resin composition for pre-peg used for laminate and printed circuit board comprises thermosetting resin and inorganic filler in which inorganic filler is oxidized graphene or graphene coated treatment.

CHAI S, SU X

Polymer resin composition useful for manufacturing an insulating film for manufacture of a build-up multi-layered printed circuit board, comprises polymer resins, and graphene for linking the polymer resins with larger attraction.

LEE K S, HONG S S, LIM H H, LEE H Y, CHO J C, KYU S L, SANG S H, HYUN H L, HWA Y L, JAE C C, HONG S, LEE H, LEE K, LIN H, JO J, LIM H, CHO J