国家/地区 中国（14）
IPC部 B（14）
IPC大类 B32（14） C08（14） C09（3）
H05（3） G10（2）
IPC小类 B32B（14）
IPC C08L063/00（14）
发明人 PAN J（3） WANG F（3） ZHANG J（3）
CHENG H（2） LI Y（2） MA C（2）
REN W（2） SUN X（2） WANG H（2）
XU J（2） ZENG Y（2）
公开年 2021（12）
申请年 2020（14）
专利权人 HUBEI TIANYU.（3） INST METAL R.（2）

Halogen-free low-dielectric epoxy resin composition useful in laminated plate and printed circuit board, comprises e.g. dicyclopentadiene epoxy resin, cresol novolac epoxy resin, maleimide resin, and 9,10-dihydro-9-oxa-10-phosphaphenan-threne-10-oxide-bisphenol phenolic resin hardener.

CHEN K, YU D

Flexible metal-based graphene electric heating material, comprises flexible insulating layer, flexible graphene resistance layer, flexible insulating layer, and metal substrate arranged sequentially from top to bottom.

LI Y, LOU M

Anti-aging soundproof cotton includes anti-aging film containing preset amount of elastic resin, polycarbonate and anti-aging agent, and having mixed fiber layer containing preset amount of glass fiber, asbestos fiber and ceramic fiber.

PAN J, WANG F

Jietu CX62 interior sound-absorbing cotton comprises e.g. inner decorative layer with surface layer and sound absorbing cotton layer provided at lower part of inner decorative layer and provided by Velcro (Fastener) surface layer.

PAN J, WANG F

Improving shore hardness of sound insulation cotton comprises weaving lightweight metal fibers that make up light metal mesh layer, pressing plates, attaching anti-aging film to sides of sound-absorbing cotton layer and heat sealing edges.

PAN J, WANG F

Automobile intelligent central control multi-layer plate has inner semi-curing sheet layer whose upper and lower sides are provided with inner copper foil layer and outer copper foil layer provided with flame retardant protective layer.

JIN S

Preparing organic substrate composite material comprises e.g. preparing semi-curing structure, pre-treating fiber filler, implanting into semi-curing structure, preparing filler solution and stable film structure, freezing and drying.

ZHANG J, CAO L, WANG Q

High thermal conductivity carbon fiber composite material with laminated hybrid structure comprises combination of carbon fiber cloth layer, sheet filler thermal conductivity network, and sheet sandwich ball laminated structure.

WANG H, SUN X, ZHANG J, MA C, LU N, ZENG Y, REN W, LIU C, CHENG H

Laminated composite material with graphene interpenetrating network structure comprises carbon fiber cloth layer, graphene foam layer, three-dimensional continuous graphene network and resin matrix.

ZENG Y, SUN X, WANG H, ZHANG J, MA C, REN W, CHENG H

Heat-resistant epoxy resin composition for preparing halogen-free intermediate-glass-transition-temperature copper-clad plate, contains graphene-modified epoxy resin, graphene-modified phenolic epoxy resin, and tetrafunctional epoxy resin.

LI Y, LIN Y, CHEN W, WEN J