国家/地区 中国（8）
IPC部 C（8）
IPC大类 C01（8） C08（8） C04（2）
C09（2）
IPC小类 C01B（8）
IPC C08L079/08（8）
发明人 GUO Y（2） ZHANG B（2）
公开年 2021（8）
申请年 2021（5）  2019（2） 
专利权人

Phthalonitrile composite material for heat conduction and insulation fields, involves heat conducting filler distributed in phthalonitrile matrix resin or heat conducting filler layer partially covered on phthalonitrile micro-sphere surface.

ZHOU H, GUO Y, ZHAO T, LIU X, DING J, ZHAO Z

Polyimide graphene composite film prepared by e.g. performing polycondensation reaction of dianhydride monomer and diamine monomer, adding graphene oxide powder, mixing, casting, removing solvent, and imidization.

QUE X, XU Z

Preparation of nano-titanium dioxide/graphene aerogel/resin-based composite material, involves reacting e.g. anhydrous ethanol and nano-titanium dioxide precursor to prepare nano-titanium dioxide precursor solution, immersing graphene aerogel, freeze-drying, performing reduction and molding.

LI W, TONG X, LU S, LI J, WANG B, MA K, XIONG X

Preparing heat dissipation film based on large-diameter graphene oxide comprises e.g. stirring modified graphene oxide, modified boron nitride, modified carbon nanotube and solvent into reactor, reacting and casting polycondensate into film.

CUI J, XU P, LI Y, ZHANG B

Preparation of graphene flexile bendable screen involves depositing organic film layer on rigid substrate, depositing graphene film layer and peeling organic film layer.

REN G, MA L, LIU S

Polyimide/graphene oxide/graphene composite film comprises a polyimide layer, graphene layer, graphene oxide layer sandwiched on the polyimide between the layer and the graphene layer.

LI M, LIU Y, WANG S, GUO Y, LIU Z

Elastic heat spreader film used for forming structural component, comprises graphitic film comprising graphitic crystals, and having preset thermal conductivity, electroconductivity and physical density, and elastomer or rubber.

LIN Y, JANG B Z, ZHANG B, JEAN B

Graphite sheet useful for electronic device, has thermal conductivity in plane direction, and thermal conductivity in thickness direction.

KIM K S, WON D Y, CHOI J Y, CUI Z, YUAN D, JIN J