国家/地区 中国（7）
IPC部 C（7）
IPC大类 C08（7） C09（3）
IPC小类 C08K（7）
IPC C08L083/04（7）
发明人 CHEN C（7）
公开年 2021（3） 2022（2） 2023（2）
申请年 2021（3）  2022（3） 
专利权人 UNIV JILIN（2）

Laminated waterproof and antibacterial medical packaging material comprises polycarbonate, sodium polyacrylate, isomeric tristyryl polyoxypropylene ether polymer, benzenesulfonyl chloride, N, N'-dimethylmethylene acrylamide, polyvinyl chloride, cetyltrimethylammonium bromide and polyethylene glycol.

ZHU X, CHEN C

Silicone foam sheet comprises silicone resin composition modified chitosan sol solution, where silicone resin composition includes carbohydroxy modified organopolysiloxane, epoxy resin, polylactic acid, alkyl phenol polyoxyethylene ether, sodium bicarbonate, water and zinc stearate.

CHEN C, LIN J

Modified polypropylene melt deposition forming granules useful in 3D printing, comprises graphene-molybdenum disulfide composite particles, hyperbranched polysiloxane and polypropylene, and prepared by e.g. mixing graphene-molybdenum disulfide composite particles, and polypropylene and granulating.

CHEN C, MEN Z, DONG J, BAI J, LIU X, WANG L

Thermally conductive silicone gel, comprises e.g. vinyl silicone oil, side hydrogen-containing silicone oil, alkoxy silicone oil, diamond, graphite, chloroplatinic acid, platinum-vinylsiloxane complexes and optional carbon black, iron red, and cobalt blue.

CHEN C

Thermally conductive silicone grease composition comprises carbon material, low melting point metal, base oil and other additives.

CHEN C, CHAI G, TAN D, FAN Z, WANG C, PAN C

Preparing organic resin composite material with 3-dimentional polyimide as thermally conductive framework comprises e.g. mixing thermally conductive filler, aromatic dianhydride and mixed solvent to perform esterification reaction.

ZHAO X, ZHAO J, WANG C, WANG D, ZHOU H, CHEN C

Preparing organic resin composite material with three-dimensional (3D) polyimide as thermally conductive skeleton by mixing aromatic diamine, aromatic dianhydride and organic solvent to perform polymerization reaction, and vacuum degassing.

ZHAO X, ZHAO J, CONG B, WANG D, ZHOU H, CHEN C