国家/地区 中国（11）
IPC部 C（11）
IPC大类 C09（11） H01（6） C08（4）
H05（3） B05（2） H02（2）
IPC小类 C09D（11）
IPC C09D007/12（11）
发明人 GAO N（2） GE Y（2） JIANG Y（2）
LI M（2） LI W（2） WANG N（2）
YU J（2）
公开年 2016（11）
申请年 2016（9） 
专利权人 PINGGAO GROU.（2） STATE GRID C.（2） TIANJIN PING.（2） UNIV CHINA E.（2）

Diaphragm comprises base layer that is made of thin film of polyetherimide, polyethylene terephthalate, polyether ether ketone, polyphenylene sulfide or polyurethane, and reinforcing layer that is made of graphene, graphite powder and glue.

HE C, YI P, MENG X

Switch cabinet has switch cabinet structure which is covered on surface of switch cabinet electric loop which is provided with graphene layer.

LI M, WANG N, GE Y, GAO N, LI W

Back film for silicon solar panel, contains graphene, ammonium phosphate, sodium tetraborate, zinc oxide, silicon carbide, soybean lecithin, vegetable oil, titanium dioxide, glycerin, polymethyl methacrylate and t-butylstyrene.

FU X

Preparing graphene composite slurry by dripping polyphenoxy resin mixed solution to graphene oxide dispersion solution, aging mixed sol, and subjecting graphene composite aerogel component to radiation sintering in microwave apparatus.

PAN M, ZHANG X, MENG G

Preparation of aqueous graphene electro-thermal film involves subjecting graphene to hydrophilization treatment, adding cellulose derivative solution, pre-dispersing, adding additive to pre-dispersed graphene and dispersing.

GAO H, JIAN L, PENG H, YAO L

Switch cabinet comprises conductive circuit surface or cabinet main portion surface covered by graphene layer.

GAO N, GE Y, LI M, LI W, WANG N

Laser cooling device comprises heat-conducting substrate connected to thermally conductive fins which are coated with graphene oxide, silver nano-particles, zinc oxide nano-particles and conductive polymer.

JIANG Y, ZHENG D, YU J, ZHU F

Graphene dispersant used in e.g. preparation of graphene composite powder, and graphene composite film, comprises polyaniline oligomer or derivative which is electroactive polymer, and combines with graphene via pi-pi bond.

DAI L, GU L, YU H, ZHENG Y, MA J, ZHAO H, LIU S, DING J

High heat radiating apparatus for electronic components comprises heat sink, metal substrate and coating on metal substrate that comprises graphene oxide, glycerol, fluorine-containing additives, hydroquinone, tetrahydrofuran and shellac.

JIANG Y, WU F, YU J, FAN H

Graphene composite film used for e.g. highly integrated electronic device, is formed by applying graphene composite infrared radiation coating comprising graphene, filler, dispersant, binder and solvent, on substrate, and curing.

LV P, WU Y, ZHANG Z, ZHANG Y