国家/地区 中国（7）
IPC部 C（7）
IPC大类 C08（7）
IPC小类 C09J（7） C08F（3） C08G（3）
C08K（3） C08L（2）
IPC C09J009/02（7）
发明人
公开年 2022（4） 2023（3）
申请年 2022（7）
专利权人

Conductive microspheres with low recovery rate used in anisotropic conductive adhesive, comprises inner core and outer metal layer, where inner core comprises styrene, azobisisobutyronitrile and intermediate component comprising carboxylated graphene, glycidyl methacrylate and catalyst.

WU F, QIAN J, LUO X

Preparing conductive acrylic pressure-sensitive adhesive useful in electronic industry, comprises e.g. ultrasonically dispersing nano-composite particles in butyl acrylate, adding dodecyl mercaptan and beta-carboxyethyl acrylate, performing secondary heating and stirring, and cooling.

LI X, WANG S, JIN X

Preparing high strength adhesive tape, involves mixing an adhesive with conductive medium to prepare adhesive, coating adhesive on release film to form adhesive layer, embedding conductive glass fiber on adhesive layer by flocking machine, adhering conductive base material on adhesive layer.

ZHANG H, QIU J

Ultra-flexible high-efficiency radiating electromagnetic shielding adhesive tape for bonding electronic product parts, has graphene radiating layer comprising polyurethane resin, nano graphene sheet, filler particles and polymethyl urea resin.

WU Y, ZHANG Q

Preparing conductive material in conductive sealing strip, involves preparing graphene oxide water solution, immersing dried polyurethane foam and vacuum drying, and further immershing in mixed solution of hydriodic acid and glacial acetic acid to obtain conductive reinforcing filler water solution.

HUANG Z, XIAO Q, XIONG J, GAO R, LIAO S

Preparing epoxy resin-based thermally conductive heat-resistant conductive adhesive film, comprises e.g. mixing epoxy resin and conductive accelerator evenly, grinding them thoroughly; adding silver powder, mixing well, vacuumizing, adding diluent, coupling agent and anti-aging agent and mixing.

QIAN L, CAO J, SONG T, WANG H

Modified silver-coated copper conductive powder epoxy conductive adhesive used as eutectic tin/palladium solder in electronic package, has bisphenol A epoxy resin, sheet-shaped silver coated copper conductive powder, spherical silver coated copper conductive powder, and nitrogen doped graphene.

GAO G, XIE J, YAN M, FAN W, CHEN P