国家/地区 韩国（4）
IPC部 C（4）
IPC大类 C01（4）
IPC小类 C01B（4）
IPC C08K003/04（4）
发明人
公开年 2022（2）
申请年 2021（2） 
专利权人

Heat dissipation adhesive sheet useful in electronic components e.g. semiconductors, or PC boards comprise metal thin film layer formed on lower surface of heat dissipation layer, and adhesive layer on metal thin film layer.

HUN L S, SONG J, KWON H J, CHOI S, YUMINSOOK, YOUK S K

Manufacture of packaging film for e.g. detergent, involves applying non-solvent two-component adhesive composition to base film on which printed layer is formed, drying, laminating base film, aging and processing film into desired shape.

JEONG H R, LEE D H

Photothermal adhesive composition for fabrication of a microfluidic chip, comprises graphene-transition metal compound composite.

CHOI H W, LEE J M, KIM Y J, LIM J H, CHUNG B G, JEA K Y, LEE J

Graphene ball conductive adhesive preparation by preparing polymer microsphere using monomer mixture, performing chemical vapor deposition to grow graphene on microsphere surface, and dispersing graphene ball into epoxy resin glue system.

CHEN Y, LI J, LI Y, ZHANG X, LEE Y