国家/地区 中国（6）
IPC部 C（6）
IPC大类 C09（6）
IPC小类 C09J（6）
IPC C09J183/07（6）
发明人 TANG R（2） WANG Y（2）
公开年 2022（6）
申请年 2022（6）
专利权人 NINGBO YUANC.（2）

Heat-conducting wave-absorbing material with electromagnetic shielding function has a two-layer structure, the upper layer is a heat-conducting wave-absorbing gel layer, and the lower layer is an aluminum foil layer.

ZHANG X, YANG Y, FAN J, ZHANG C, MA C, WANG Z

Thermally conductive adhesive used for bonding electronic circuit base plate for circuit board, comprises composite resin, thermally conductive filler, vinyl-terminated silicone oil, platinum catalyst, curing agent and leveling agent.

ZHONG L, LI R

Low-viscosity flame-retardant heat-conducting solvent-free polyurethane electronic potting adhesive comprises polyether polyol, modified polyurethane prepolymer, heat-conducting powder, modified graphene oxide, vinyl silicon oil, fire retardant, anti-foaming agent, dispersing agent, coupling agent.

WANG Y, TANG R

Low viscosity high heat conductivity flame retardant two-component polyurethane potting sealant useful for bonding electronic component comprises e.g. polyurethane pre-polymer, composite flame retardant material, heat conductive filler, amide tin catalyst and organosilicone defoaming agent.

TANG R, WANG Y

Single-component addition type heat-conducting bonding agent comprises vinyl silicone oil, heat conducting filler, surface treatment agent, tackifier, pH value regulator, hydrogen-containing polysiloxane, catalyst, and inhibitor.

LIU J, YU L

Preparing heat conducting electronic potting adhesive comprises adding terminal disiloxane monomer to ethanol solution, stirring, hydrolyzing, vacuum distilling, filtering, adding e.g. vinyl polydimethylsiloxane and modified radiating filler and platinum catalyst, stirring, kneading and defoaming.

SUN X