国家/地区 中国（3）
IPC部 B（4）
IPC大类 C09（4） B32（2） H01（2）
IPC小类 C09K（4） B32B（2） H01L（2）
IPC C09K005/14（4）
发明人 WANG H（4）
公开年 2021（2） 2022（2）
申请年 2021（4）
专利权人

Thermal conductive structure comprises thermally conductive metal layer, and structural layer arranged on thermally conductive metal layer, where structural layer is stacked structure formed by graphene layer and ceramic material layer or structural layer is graphene-mixed ceramic material layer.

HUANG H, HUANG C, HE M, HANCHANGHUANG, HE M X, HUANG J K, HUANG H Z, WANG H

Preparing oriented thermally conductive sheet, comprises e.g. placing prepared fluid composition in orientation molding device, applying high-speed shearing force layer by layer and orienting thermally conductive filler to form continuous multi-layer assembly, then thermally curing, and slicing.

HE C, LIAO X, WANG H, WU P, REN Z

Directional high thermal conductivity thermal interface thermal conductivity material useful for high thermal conductivity graphite-based thermal interface composite material structure, comprises graphite paper and silicone rubber.

ZHU Y, WANG H

Preparing fibrous mesoporous silica grown on surface of graphene oxide, involves adding graphene oxide to deionized water, dispersing, adding e.g. catalyst urea, adding n-pentanol to cyclohexane, adding tetraethyl orthosilicate, and drying.

WANG H, ZHOU B, MA W, ZHEN L, FU Y, YANG Y, DUAN X, ZHANG M