国家/地区 中国（8）
IPC部 B（8） C（8） F（2）
IPC大类 B32（8） C09（8） C08（2）
IPC小类 B32B（8）
IPC C09K005/14（8）
发明人 LIU Y（2） WANG H（2）
公开年 2021（8）
申请年 2020（4）  2021（4） 
专利权人

Graphene composite radiating film comprises n-layer graphene film and m-layer worm graphite film.

CHENG W, LIU X, ZHOU Y, WANG W, LI L

Directional high thermal conductivity thermal interface thermal conductivity material useful for high thermal conductivity graphite-based thermal interface composite material structure, comprises graphite paper and silicone rubber.

ZHU Y, WANG H

Phase change energy storage thermal insulation plate containing aerogel useful e.g. in composite material field, comprises skin layer structure covering surface of core plate structure including uniform porous material and filling layer.

LI T, WANG Y, LI Q

Heat conducting chain based on graphene macroscopic assembly film has a normal heat conducting layer located at the cold end and the hot end, and includes a solder layer which is connected with the surface of the graphene layer.

GAO C, ZHOU J, LIU Y, LIU Z, XU Z, WANG Z, HE G

High heat-conducting graphene floor heating pipe comprises pipe body, polyethylene layer, steel wire net layer, and graphene heat-conducting layer including graphite, antioxidant, dispersant, coupling agent, heat stabilizer, and plasticizer.

XU W, LIU Y, ZHANG H

Flexible heat transfer material for thermally contacting one cell within a battery pack, comprises a matrix and a filler and the thermal conductivity of the filler is greater than the thermal conductivity of the matrix.

FLANNERY B

High thermal conductivity carbon fiber composite material with laminated hybrid structure comprises combination of carbon fiber cloth layer, sheet filler thermal conductivity network, and sheet sandwich ball laminated structure.

WANG H, SUN X, ZHANG J, MA C, LU N, ZENG Y, REN W, LIU C, CHENG H

Preparing complex material based on vertical polymer film array comprises e.g. cutting polymer film into multiple films of same shape and size, and opening multiple through holes on surface of films to obtain unit films.

HE D, FU H, XIAO Y