国家/地区 中国（6）
IPC部 C（7）
IPC大类 C08（7）
IPC小类 C08K（7）
IPC C09K005/14（7）
发明人
公开年 2023（7）
申请年 2022（7） 
专利权人

Preparing high thermal conductivity insulating polyvinyl butyral intermediate film, comprises e.g. adding few-layer graphene and dispersant into solvent, using high-shear equipment to stir, adding hexagonal boron nitride, silane coupling agent hydrolysis liquid, and polyvinyl butyral, and stirring.

BOHM S, XIAO F, LIU S, QIAO S, RONG C, FENG D

Heat-conducting gel used for heat dissipation of electronic device, comprises silicone oil matrix, bisphenol-A-type epoxy resin and heat-conducting filler comprising modified graphene, modified diamond and modified carbon nanotubes, where surface of modified graphene is modified with amino group.

HE Y, LIU F, YU G

Preparation of oriented heat conducting sheet used in semiconductor heat dissipating device, involves placing fluid composition in orientation molding device having sleeve barrel, applying circumferential shear force, heat-curing formed multilayer aggregate, and slicing oriented composition block.

REN Z, WANG H, GU Z

Preparing heat intelligent material by mixing agglomerant, heat conducting material, thermal expansion material and solvent, freezing first mixture, impregnating second mixture, curing and obtaining heat intelligent material.

WANG J, YANG Y

Preparing perovskite quantum dot/4-aminophenylporphyrin/graphene oxide high thermal conductivity composite film used in heat dissipation comprise coating toluene dispersion of perovskite quantum dots on 4-aminophenylporphyrin, and graphene oxide composite thermal conductivity film.

WANG S, LUAN Y

Electronic device such as chip, comprises electronic component, heat sink in which surface its is provided with magnetic layer containing permanent magnetic material, and composite thermal-conductive material comprising organic matrix and ferromagnetic particles.

FANG H, XU Y, ZHENG K

Composite material useful in field of electronic component comprises e.g. poly(butylene terephthalate), graphene micro sheet, carbon nanotubes, ethylene methyl acrylate glycidyl methacrylate terpolymer, gamma-aminopropyltriethoxysilane and vinyl acetate ethylene copolymer emulsion.

YI Q, LU J, WANG Z