国家/地区 中国（431）
IPC部 C（431）
IPC大类 C08（431） C09（431） B29（34）
H05（31） H01（22） C01（19）
B32（9） B33（6） B82（6）
C04（6） F21（4） F28（4）
B01（3） B60（3） B02（2）
IPC小类 C08K（431）
IPC C09K005/14（431）
发明人 LIU Y（26） LI J（22） ZHANG Y（16）
DING P（15） SHI L（13） ZHANG X（13）
LI Z（12） SONG N（12） ZHANG W（12）
GUO Y（11） LI X（11） LIN Y（11）
LIU Z（11） WANG X（11） WANG Y（11）
公开年 2021（89） 2018（78） 2022（70） 2017（64） 2020（54） 2019（24） 2023（24） 2016（9） 2015（8） 2014（4） 2013（3） 2012（2）
申请年 2020（82）  2017（69）  2022（61）  2021（59）  2018（51）  2019（50）  2016（32）  2014（9）  2015（7）  2013（3）  2023（3）  2011（2）  2012（2） 
专利权人 UNIV SHANGHA.（18） NINGBO INST .（8） UNIV SICHUAN（8） ENN GRAPHENE.（6）
HEZHOU BAOXI.（6） SHENZHEN INS.（6） UNIV SOUTH C.（6） HANGZHOU FUX.（5）
UNIV GUANGDO.（5） ANHUI AEROSP.（4） CHINA PETROL.（4） DEYANG ZHONG.（4）
GUANGDONG MO.（4） HUAWEI TECHN.（4） SINOPEC BEIJ.（4） UNIV EAST CH.（4）
UNIV JILIN（4） UNIV TIANJIN（4） HUNAN GONSIO.（3） INST METAL R.（3）

Preparing graphene heat-conducting silicone grease comprises e.g. adding graphite into ultrapure water, stirring, using mechanical stripping process to obtain graphene slurry, filtering to get filter cake, adding transfer solvent, stirring, and utilizing transfer solvent to wash graphene slurry.

MA Y, LI Y, FENG J, LI X, LIU H

Preparing chitosan modified boron nitride and graphene fiber composite material useful for thermal conductivity modification of epoxy resin, comprises e.g. dissolving chitosan in acetic acid solution, adding phytic acid solution containing choline chloride, adding boron nitride and centrifuging.

ZHANG Q, WANG S

Preparing high thermal conductivity and low dielectric epoxy composite material used in electronic packaging field, involves preparing polyimide, dispersing polyimide microspheres and low-dimensional thermally conductive insulating fillers in solvent, mixing polyimide microsphere with epoxy resin.

ZHONG R, LIANG J, CAI H, TU S, HU D

Highly flexible thermal gasket, comprises vinyl silicone oil (e.g. vinyl-terminated polydimethylsiloxane), hydrogen-containing silicone oil (e.g. terminal hydrogen-containing silicone oil), thermal conductive filler (e.g. alumina), catalyst, coupling agent, and inhibitor.

LIN Y, CHEN D, LIU W, XIANG L, JIANG X

Preparing high thermal conductivity insulating polyvinyl butyral intermediate film, comprises e.g. adding few-layer graphene and dispersant into solvent, using high-shear equipment to stir, adding hexagonal boron nitride, silane coupling agent hydrolysis liquid, and polyvinyl butyral, and stirring.

BOHM S, XIAO F, LIU S, QIAO S, RONG C, FENG D

Preparing three dimensional thermally conductive skeleton/polyimide thermally conductive composite material comprises subjecting thermally-conducting porous material soaked by polyamic acid solution, performing freeze drying and phase conversion treatment to thermally-conducting porous material.

CHEN C, ZHAO X, ZHOU H, ZHAO J, YANG L, WANG D

Heat conducting filler master batch used in polypropylene composite material for extruding and absorbing plastic and preparation of electronic components, comprise high pressure polyethylene, aluminum oxide, graphene, coupling agent, dispersant, and antioxidant.

CHEN P, XU H, SHE H, HUANG F, CHEN X, GONG W

Heat-conducting gel used for heat dissipation of electronic device, comprises silicone oil matrix, bisphenol-A-type epoxy resin and heat-conducting filler comprising modified graphene, modified diamond and modified carbon nanotubes, where surface of modified graphene is modified with amino group.

HE Y, LIU F, YU G

Polyurethane high-thermal conductivity film used as photothermally controllable film, is prepared by reacting three-dimensional carbon composite powder and thermoplastic polyurethane, concentrating obtained three-dimensional carbon/polyurethane assembly, dripping on substrate and heat-treating.

CHEN J, WANG C, LI H, LUO W

Heat-conducting gel for battery filling, comprises silicone A, thermal conductive filler, cross-linking agent as component A, and silicone B, catalysts, chain extender as component B, and prepared by mixing silicone A, thermally conductive filler and crosslinking agent to obtain component A.

LIN Y, CHEN F, XIANG L, JIANG X