国家/地区 中国（129）
IPC部 C（129）
IPC大类 C09（129） C08（61） C01（23）
H01（10） H05（8） C04（7）
B29（6） C23（6） B32（5）
C07（4） F24（4） B01（3）
B82（3） B23（2） B33（2）
IPC小类 C09K（129）
IPC C09K005/14（129）
发明人 WANG H（9） ZHANG J（7） LI J（6）
LI X（6） LI Z（6） WANG X（6）
ZHANG X（6） LI Q（5） LI Y（5）
LIU X（5） WANG Z（5） ZHANG Y（5）
DING P（4） GE X（4） LI C（4）
公开年 2021（78） 2022（48） 2023（3）
申请年 2021（129）
专利权人 UNIV EAST CH.（4） UNIV SHANGHA.（4） HANGZHOU FUX.（3） UNIV SICHUAN（3）
CHN ENERGY I.（2） GUANGDONG MO.（2） GUANGZHOU NA.（2） HUIMAI MATER.（2）
INST METAL R.（2） NAT INST CLE.（2） NEW MORE GRA.（2） NINGBO INST .（2）
SHENZHEN MAT.（2） TAIXING ZHIF.（2） UNIV ANHUI（2） UNIV DATONG（2）
UNIV GUANGXI.（2） UNIV SHANGHA.（2） UNIV TIANJIN（2） UNIV XIAMEN（2）

Preparing ultra-high elastic polyimide fiber/graphene composite gas gel comprises e.g. dispersing polyimide chopped fiber in alkali solution, performing surface modification, mixing graphene solution dispersion liquid with polyimide chopped fiber, dialyzing, freezing and drying.

FENG Y, YIN W, FENG W

Use of nitrogen-doped graphene metal material in heat-conducting field where nitrogen-doped metal graphene comprises metal base material and nitrogen-doped graphene.

WU Q, MA Y

Metal-carbon based composite material used in low-temperature thermal energy storage device and solar energy and industrial waste heat treatment, comprises main porous carbon substrate composed of metal-organic framework-derived graphene-based porous carbon and compound composited with the substrate.

XING G, ZHOU T, LI C, LI X, QU W, ZHANG J, YANG X, LI S, ZHAO J

Heat-conducting and wave-absorbing integrated flexible material useful in the field of electronics, communications, automobiles, medical appliances, household appliance products, aerospace, security monitoring and navigation.

WU W, YAO Q, WU L, YANG X, TONG G

Heat accumulation of carbon material with z-plane orientation degree and high degree of graphitization and specific degree of overall orientation, prepared by mixing thermally conductive fillers, agglomerant and high thermally conductive additives, and pressing and molding.

ZHANG H, YU D, WEI J, SHENG Y, GAO G, ZHENG D, LIANG W, LIU J, DUAN C

High-strength heat accumulation carbon material useful in heat accumulation and/or heat dissipation field, prepared by mixing components in high-strength heat storage carbon material composition, molding, sintering or graphitizing molding material in inert atmosphere.

ZHANG H, YU D, WEI J, GAO G, ZHENG D, SHENG Y, LIANG W, LIU J, DUAN C

Electromagnetic interference (EMI) shielding device has dielectric layer and layer of fillers that have volume overlapped with each other when carbon-based materials are self-aligned in presence of magnetic field.

LIU C, LI W C, CHEN X, KWOK C H, LI W, GUO Z

Heat-conducting graphene sheet filling hole copper-covering structure for use in electronic radiating field, has heat conducting graphene sheet whose upper and lower surfaces are uniformly coated with copper layer.

LIU Y, HUANG K, QIN F, WEI T

High heat-conducting polyimide film with good film-forming properties comprises aromatic diamine monomer, aromatic dianhydride monomers, heat-conducting filler, film-forming auxiliary materials and polar solvents.

LI X, LAI Z, FENG L, LIANG X, LIU Z, ZHU X

High thermal conductivity organosilicon gel comprises unsaturated hydrocarbyl organopolysiloxane, organosiloxane coupling agent, thermally conductive filler, catalyst, cross-linking agent, chain extender, and reaction inhibitor.

ZHANG Y, ZHAO J, CEN C