国家/地区 美国（31）
IPC部 C（31） H（23） B（13）
F（5） G（2）
IPC大类 C08（31）
IPC小类 C09K（31） C08K（27） C08J（17）
C08L（14） C01B（12） H01B（12）
C09D（10） H05K（10） H01L（9）
B82Y（6） B32B（4） C08G（4）
C09C（4） F28F（4） B01J（3）
IPC C09K005/14（31）
发明人 LIN Y（3） ADAMSON D H（2） CHAN C（2）
CHANG H（2） CHOU T（2） DING J（2）
DOBRYNIN A V（2） JANG B Z（2） LI L（2）
LIAO W（2） ROSS J（2） STOJANOVIC H（2）
WOLTORNIST S（2） WU F（2）
公开年 2021（8） 2017（5） 2016（4） 2022（4） 2013（2） 2014（2） 2015（2） 2023（2）
申请年 2020（7）  2016（4）  2021（4）  2014（3）  2015（3）  2012（2）  2017（2）  2022（2） 
专利权人 FUJI POLYMER.（3） L P PROPERT.（2） NANOTEK INST.（2） NITRONIX INT.（2）
UNIV CONNECT.（2）

Thermally conductive material comprises base polymer, ethylene methyl acetate, graphite fibers and bis(2-ethylhexyl) adipate.

PARE R, KAMAVARAM V

Preparation of oriented heat conducting sheet used in semiconductor heat dissipating device, involves placing fluid composition in orientation molding device having sleeve barrel, applying circumferential shear force, heat-curing formed multilayer aggregate, and slicing oriented composition block.

REN Z, WANG H, GU Z

Flexible cellular foam product used for article e.g. mattress, comprises flexible foam substrate, and coating layer comprising highly thermally-conductive nanomaterial, and binder which is at least one chosen from, e.g. acrylic polymer emulsions and styrene-butadiene latex.

STOJANOVIC H, SCHERREY A N, CRAWFORD M L

Composition comprises poly(arylene ether), where poly(arylene ether) is polymeric reaction product of one disubstituted benzophenone and polyol and one polyol comprises one fluorinated diol.

CONNELL J W, BELCHER M A, GHOSE S

Composite for article of manufacture such as medical cushioning foam, mattress, mattress topper pad, pillows, bedding product and pet beds, comprises flexible cellular foam and highly thermally-conductive nanomaterials dispersed in foam.

GRAMLICH T, STOJANOVIC H

Heat-conductive silicone heat radiation material used as thermal interface material between heating portion of electronic component and heat sink comprises silicone polymer, heat-conductive inorganic filler, and heat-resistance improver.

KOBAYASHI S, KIMURA Y, SHINGO K, YUKO K

Phthalonitrile composite material for heat conduction and insulation fields, involves heat conducting filler distributed in phthalonitrile matrix resin or heat conducting filler layer partially covered on phthalonitrile micro-sphere surface.

ZHOU H, GUO Y, ZHAO T, LIU X, DING J, ZHAO Z

Microelectronic device used in system, comprises microelectronic die, and composite material comprising composite material comprises polymer chain chemically bonded to fill particles comprising hexagonal lattice of carbon atoms.

MATAYABAS J C, BOZORGGRAYELI E, GAINES T, TEJEDA F M E

Silicone resin composition used for composite material for heat conductive silicone sheet for electronic component, comprises silicone resin and heat resistance improving agent comprising organic polycyclic aromatic compound containing secondary amino groups and ketone groups in cyclic structure.

MAKOTO I, KATSUYUKI S, YUJI N, IWAI M, SUZUMURA K, NAKAJIMA Y, NAKASHIMA Y

Acrylic metal salt composition for resin composition, is prepared by making acrylic acid, divalent metal oxide, and thermally conductive powder in non-polar solvent, and removing solvent to obtain metal acrylate composition.

TSOU C P, CHIU K, CHEN Z, HUANG T T, HUANG T, TSOU C