国家/地区 中国（3） 日本（2）
IPC部 C（4）
IPC大类 C01（4）
IPC小类 C01B（4）
IPC C22F001/08（4）
发明人 CHIBA Y（2）
公开年 2013（2） 2021（2）
申请年
专利权人 JX NIPPON MI.（2）

Preparing high-orientation and high thermal conductivity graphene/copper composite material used as thermal-conducting reinforcing body for electronic device heat power density, comprises e.g. adding isopropanol into ethanol, ultrasonically processing, and forming highly oriented graphene film.

LI L, ZHANG W, DONG L, HUO W, LI X, CHANG G

Preparation of graphene nano-narrow band by electrifying aluminum sheet as cathode and copper foil as anode into electrolytic polishing solution, drying copper foil, photoetching and patterning with graphene and hydrogen plasma etching.

CHEN C, HE Z, JIANG S, SHI F, WANG G, ZHOU Q

Copper foil for manufacturing graphene, has specified arithmetic mean roughness in rolling parallel direction and rolling perpendicular direction.

CHIBA YOSHIHIRO, CHIBA Y, CHIBA G, YOSHIHIRO C

Copper foil used for graphene manufacture, consists of copper plating layer containing hydrogen in ratio above preset value, and having glossiness above preset value in rolling parallel direction and right angle direction.

CHIBA Y