国家/地区 中国（6）
IPC部 C（6）
IPC大类 C22（6）
IPC小类 C23C（6） C22C（5） B05D（2）
C01B（2） C21D（2） C22F（2）
C25D（2）
IPC C23C014/16（6）
发明人 LI X（2）
公开年 2021（2） 2023（2）
申请年 2021（2）  2023（2） 
专利权人

Method for preparing anti-oxidation bonding alloy silver wire containing graphene on surface in microelectronic packaging field, involves using polystyrene as carbon source to grow graphene on surface of copper plating layer to obtain bonded silver wire containing graphene on surface.

LI Y, LI S

Preparing battery steel case coated with metal layer on the surface, comprises e.g. grinding surface of low-carbon steel strip, performing electroplating in nickel-iron plating solution, surface magnetron sputtering of cobalt, and electroplating in nickel-iron-cobalt-phosphorus plating solution.

LI J, ZHOU H

Preparing high-orientation and high thermal conductivity graphene/copper composite material used as thermal-conducting reinforcing body for electronic device heat power density, comprises e.g. adding isopropanol into ethanol, ultrasonically processing, and forming highly oriented graphene film.

LI L, ZHANG W, DONG L, HUO W, LI X, CHANG G

Surface modified copper bus bar, has lapping surface and non-overlapping surface of copper bus are attached with silver bottom layer by magnetic control sputtering technology.

LIN Q, MEI Z

Graphene coating material for enhancing surface hardness, comprises nickel, graphene material, alumina, titanium, molybdenum, chromium, silicon, silicon dioxide and cobalt, and has simple operation and strong feasibility.

LU W, LI X

Fabricating graphene to fabricate FET, comprises forming alloy catalyst layer on substrate using sputtering method and/or evaporation method, and forming graphene layer on alloy catalyst layer by supplying hydrocarbon gas onto substrate.

WOO Y, SEO D, SEO S, CHUNG H, KANG S, HEO J, SEO S A, CHUNG H J, KANG S R, HEO J S, WOO Y S, JUNG H J, HUH J S, YEO R, XU D, HUH J, JUNG H