国家/地区 中国（4）
IPC部 C（4）
IPC大类 C22（4）
IPC小类 C22F（4）
IPC C22F001/08（4）
发明人
公开年 2021（4）
申请年 2021（3） 
专利权人

Method for reducing resistivity of single crystal copper wire, involves annealing single crystal copper under non-oxidizing gas and protective gas atmosphere, introducing carbon-containing gas into copper wire, reacting and cooling.

NOVOSELOV K

Vertical graphene composite heat conducting copper foil comprises copper foil substrate layer adhered with two plane graphene layers at surface and bottom, where surfaces of plane graphene layers have vertical graphene layers.

ZHANG L, YE Q, WANG X, SHEN L

Board comprises first copper foil, graphene layer and second copper foil, second copper foil is electroplated copper.

LIU K, DING Z, ZHANG Z, KOU J, HUANG Z, YUE X, CHEN Y, WANG E

Manufacturing graphene thin film composite copper base heat sink comprises forming graphene thin film layer, forming metal film layer on graphene thin film layer, and carrying out hot pressing treatment to metal film layer.

RU Z, MA W, LIANG B, SONG H, ZHU Y, SONG S, YIN Z