国家/地区 中国（6）
IPC部 C（6）
IPC大类 C08（4） C09（3） C25（3）
IPC小类 C08L（4） C08J（3） C09D（3）
C25D（3） C08K（2）
IPC C09D011/03（3） C09D011/102（3） C09D011/52（3）
C08J007/044（2） C08L101/00（2） C09D011/107（2）
C25D005/56（2）
发明人 WU B（6）
公开年 2023（6）
申请年 2022（6）
专利权人 TAN KAH KEE .（3） UNIV XIAMEN（3）

Conductive ink used for preparing electroplated plastic, comprises water-based resin binder, conductive filler, swelling agent and solvent.

ZHENG N, SUN J, SHAO Z, WU B

Conductive ink used for preparing plastic material, comprises resin binder, conductive filler, pore-forming agent and solvent, where resin binder comprises epoxy resin, polyurethane, alkyd resin, silicone resin, thermosetting acrylic resin and/or thermoplastic acrylic resin.

ZHENG N, SUN J, SHAO Z, WU B

Processing wafer level single crystal graphene heterojunction by direct growth method, comprises e.g. pre-processing the polycrystalline metal foil to obtain single crystal metal foil, using the crystal orientation inducing method to grow hexagonal boron nitride single crystal domain.

LI Y, WU B, LIANG S, LI S, ZHANG X, HU P, ZHANG J

Porous conductive ink used in electroplating pretreatment technology, comprises graphene, conductive particles, binder, hydrophilic oxide, high boiling point solvent and low boiling point solvent.

ZHENG N, SHAO Z, SUN J, WU B

Cell regulator useful in preparing polyurethane foam comprises e.g. polyether modified silicone surfactant, dimethicone, fatty acid polyoxyethylene ester, fatty alcohol polyoxyethylene ether, alkyl aryl sulfonate, polypropylene wax, polytetrafluoroethylene wax, polyamide wax and inorganic powder.

ZHANG H, ZHU J, WU B, WAN Q

Preparing high-absorbing polymer-based electromagnetic shielding composite material useful in portable micro-electronic device, comprises crushing prepared magnetic particle/polymer composite material and conductive filler, paving in multiple layers and carrying out thermocompression molding.

ZHU H, WEN X, WU B