国家/地区 中国（15）
IPC部 B（15）
IPC大类 B32（15） C08（15） D06（3）
B29（2） H05（2）
IPC小类 B32B（15）
IPC C08L063/00（15）
发明人 CHEN J（2） CHEN K（2） HE H（2）
LIU Y（2） WANG L（2） WANG Y（2）
YU D（2）
公开年 2022（15）
申请年 2022（9）  2021（5） 
专利权人 HUIZHOU ZHON.（2） ITEQ WUXI EL.（2）

Preparing X-band stealth/lightning protection skin comprises laying up carbon fiber prepreg, conductive prepreg, wave-absorbing prepreg and wave-transmitting prepreg in sequence on surface of tooling, obtaining first skin, and molding first skin by vacuum bag process.

LI B, SONG Z, WEN Y, LIU Y

Processing high-strength computer back cover with middle frame, involves cutting epoxy glass fiber board to obtain middle frame board and cover board, milling mounting cavity on middle frame plate to form middle frame and then middle frame and cover plate are welded to obtain computer rear cover.

CAI C, YU F, LU M, CHEN J, HE H

In-situ wetting conversion structure used in liquid drop dynamic control platform for liquid drop transfer, microfluidic and biochemical engineering comprises shape memory micro-structure surface covered on base body, and base body of electric heating film is dimethyl silicone polymer.

SUI X, SUN Y, XUE Y, WANG Y, LIANG W

Epoxy resin-based copper-clad plate filled with alumina used for e.g. electric device insulation has electronic glass fiber cloth, dipping material and copper foil, where electronic glass fiber cloth is soaked in dipping material and processed into prepreg and copper foil set on two sides of prepreg.

WU H, CHEN Y

Epoxy resin composite material comprises component A and component B that are compounded with each other, where component A includes epoxy resin, preservatives, ultra-fine light calcium carbonate powder, graphene, and component B including carbon fiber mixed cloth woven from carbon fiber threads.

ZHANG W, FEI G, YUAN S

Producing textured composite board mobile phone cover, comprises mixing epoxy resin, allyl-containing epoxy monomer and curing agent to obtain a glue solution, coating glue on sides of modified glass fiber cloth, curing to form prepreg, placing textured film on upper surface, and hot pressing.

CHEN H, CHEN J, WANG B, HE H, ZHANG Z

Epoxy resin geothermal floor useful in the technical field of building decoration materials, comprises surface decoration layer, epoxy resin board layer composed of glass fiber powder, carbon fiber, methylene diphenyl diisocyanate, cured epoxy resin fiber and dispersants and moisture-proof layer.

ZHAO B, WU M, DENG Y, GONG H, JIANG Z, WANG S, TANG Z

Low-expansion coefficient halogen-free resin composition useful in laminate for printed circuit board, comprises e.g. o-cresol formaldehyde epoxy resin, bismaleimide resin, cyanate ester hardener and bisphenol A type 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide hardener.

CHEN K, YU D

High heat conducting graphene magnetic composite material comprises graphene film layer and substrate layer, where preparation raw material of graphene film layer comprises graphene, composite base material and solvent, and substrate layer comprises soft magnetic material and hard magnetic material.

LIN Y, JIANG X, CHEN F, JIANG W, FANG W

Preparing a electric response shape memory composite material useful in electric drive shape memory polymer material low resistor and high stability, comprises e.g. taking shape memory polymer solution/prepolymer solution, dispersing and forming uniform conductive slurry and coating into groove mold.

LIU Y, ZHANG F, HU R, LENG J