国家/地区 |
中国(4)![]() |
IPC部 |
C(4)![]() |
IPC大类 |
C23(4)
C01(3)
H01(3)
A41(2) B01(2) B32(2) C30(2) |
IPC小类 |
C23C(4)
C01B(3)
H01L(3)
A41D(2) B01D(2) B32B(2) C30B(2) |
IPC |
C23C016/26(4)![]() |
发明人 |
PARK H(4)![]() |
公开年 | |
申请年 | |
专利权人 | HEIQ MATERIA.(2) |
PARK J, LI J, JIN D, SUN W, KIM T, YIN Y, TIAN Z, BAK H, PARK J H, LEE K J, KIM D W, SUN W H, KIM T S, YOON W J, JEON J H, PARK H K, PARK H, JEONJINHO, YUN W J, WOO K D, LEE K
CHOI K, PARK H G, HEIGHT M, CHOI K J, PARK H, PIAO H
PARK H G, HEIGHT M, CHOI K, PARK H
PARK H B, KIM H, YOON H W, PARK S M, LEE M Y, HO B P, HEE W Y, SUN M P, YONG L M, LEE M, PARK H, PARK S, YOON H