国家/地区 美国（35） 中国（21） 世界知识产权组织（20） 韩国（18） 日本（13） 台湾（13） 欧洲专利局（EPO）（10） 西班牙（4） 加拿大（2） 德国（2）
IPC部 B（42）
IPC大类 B32（42） C01（42） B82（29）
H01（20） C23（14） C25（7）
B05（6） B01（5） C08（4）
B21（3） C22（3） C30（3）
H05（3） B29（2） B44（2）
IPC小类 B32B（42）
IPC C01B031/04（42）
发明人 CHIBA G（3） CHIBA Y（3） CHOI J（3）
HAN S（3） NAGATA T（3） OGUNI T（3）
OSADA T（3） YOSHIHIRO C（3） CHOI J Y（2）
GUO L（2） HASEGAWA S（2） KOKUNI T（2）
LI X（2） LI Y（2） NOMOTO K（2）
公开年 2012（19） 2013（16） 2014（7）
申请年 2012（42）
专利权人 SAMSUNG ELEC.（4） GRAPHENE PLA.（3） INT BUSINESS.（3） JX NIPPON MI.（3）
NIPPON MININ.（3） NIPPON MININ.（3） SEMICONDUCTO.（3） HON HAI PREC.（2）
HONGFUJIN PR.（2） NIPPON MININ.（2） SUNG C（2） UNIV SUNGKYU.（2）
UNIV TSINGHU.（2）

Structure and method for a graphene-based apparatus comprises acts of forming a graphene layer on a metal layer; forming a protective layer on the graphene layer.

HAN S, CAO Q

Unitary graphene layer or graphene single crystal useful for heat-spreading applications e.g. as a heat spreader or a heat sink product in e.g. hand-held device comprises closely packed and chemically bonded parallel graphene planes.

ZHAMU A, WANG M, XIONG W, JANG B Z

Graphene-based composite structure, useful as topological insulator in thin film transistor, comprises graphene layer, transition metal layer and substrate, where graphene layer and transition layer are coupled by orbitals hybridization.

DUAN W, LI Y, CHEN P, WU J, GU B

Electrochemical etching method for removing metal substrate layer from graphene layer, involves connecting graphene layer or metal substrate layer to power source to supply current to etch metal substrate layer from graphene layer.

HAN S, GUO L, LI X

Apparatus for electrochemical or electroplating etching of copper foils from graphene for e.g. electronic device application, has anode including metal substrate layer etched from graphene layer in response to current flowing through anode.

HAN S, GUO L, LI X

Tubular graphene laminate used for, e.g. pipes, consists of graphene film to which carbon is covalently bonded, formed in tubular shape by being arranged along inner surface side or outer surface side of tubular support layer.

HASEGAWA SHOJI

Transferring graphene film involves disposing patterned protection layer on second surface of carrier, patterning carrier, disposing patterned carrier with first graphene film on target substrate, and removing patterned carrier.

TZENG Y, CHEN W

Production of graphene laminate used for e.g. transparent electrode, involves bonding adhesive layer provided on one surface of base to graphene film-side surface of another base provided with graphene film, and peeling another base.

HASEGAWA S

Manufacture of molding component involves adhering graphene laminate including base having predetermined strength and layer(s) of graphene film in which carbon atoms are covalently bonded to component when component is molded.

HASEGAWA S

Composition, useful in an electronic device, spintronic device or optoelectronic device, comprises ordered film of boron nitride containing multiple layers, where the film has a major surface, and a layer of graphene formed on major surface.

KELBER J A