国家/地区 中国（27）
IPC部 B（27）
IPC大类 B32（27） C08（14） C09（5）
C01（3） H05（3） C04（2）
C23（2） D06（2） E04（2）
IPC小类 B32B（27）
IPC B32B037/06（27）
发明人 LIU Y（3） ZHANG Y（3） CHENG X（2）
WANG L（2） WANG Q（2） WANG Y（2）
ZHANG J（2）
公开年 2021（18） 2022（9）
申请年 2021（27）
专利权人

Graphene multifunctional insole comprises insole main body comprising base pad body, graphene conducting layer and ventilation layer, ventilation hole arranged on ventilation layer, and heat conducting reinforcing block embedded on conducting layer.

FU X

High heat conducting graphene magnetic composite material comprises graphene film layer and substrate layer, where preparation raw material of graphene film layer comprises graphene, composite base material and solvent, and substrate layer comprises soft magnetic material and hard magnetic material.

LIN Y, JIANG X, CHEN F, JIANG W, FANG W

Continuous fiber bundle reinforced composite material that is used for preparing photovoltaic module backplane material, automobile shell, battery shell, rail transit equipment shell, aircraft portion, comprises strip material layer, and upper film layer and lower film layer.

WU X, CHEN H, CHENG X, HAN X, TANG K, CUI B, HU Q, WANG L, YAN S

Lightweight soundproof vinyl floor comprises PVC layer containing lightweight porous graphene material as bottom layer material and middle layer material, color printed PVC film as printing layer, and conductive UV coating as surface conductive wear-resistant layer.

WANG K, ZHANG Q, WANG C, TONG Y, QIAN J

Wave-absorbing material comprises a first skin, wave-absorbing honeycomb core layer, second skin and reflecting layer, surface of wave-absorbing honeycomb core layer is provided with coating and raw material of coating comprises resin.

HU H, WANG J, YIN S, PENG X, MING P

Preparing degradable polypropylene copolymer composite board comprises dissolving silicon dioxide and sisal fiber in toluene solution, mixing, heating, introducing nitrogen, adding toluene solution of L-lactide and stannous octoate, and reacting.

WANG Q, ZHONG C, XIANG H

Composite structure heat conducting plate for use in electronic chip industry, has m metal layers and n graphite layers, where m metal layers and n graphite layers are alternately arranged and assembled by vacuum diffusion bonding process.

HU T, NIU T, GUO S, CHEN X

Glass fiber cloth reinforced thermosetting copper-clad plate comprises glass fiber cloth, and copper foil bonded with resin adhesive on one or both sides of glass fiber cloth, the resin adhesive is formed by mixing adhesive and flame retardant and surface of copper foil is coated by coating.

CHEN M, WANG L, HE W, ZHAN H

Composite material used for improving electroconductivity of metal, has graphene fragment layer that comprises graphene fragments uniformly spread on metal foil layer.

GONG M, SUN B, WANG Y, CHEN Q, YANG W, LI Y, LIANG J, LIU B, ZHANG X, PEI Z

Preparation of whiteboard paper containing graphene heat-conducting layer with ink absorbing performance involves forming graphene permeable core layer paper layer and graphene permeable type surface layer paper layer, detecting surface properties, compounding, surface sizing, drying and shaping.

HU X