国家/地区 中国（3）
IPC部 B（4）
IPC大类 B32（4）
IPC小类 B32B（4）
IPC C08L079/08（4）
发明人 CHEN K（3） YU D（3）
公开年 2022（3）
申请年 2021（2） 
专利权人 ITEQ WUXI EL.（3）

Low-expansion coefficient halogen-free resin composition useful in laminate for printed circuit board, comprises e.g. o-cresol formaldehyde epoxy resin, bismaleimide resin, cyanate ester hardener and bisphenol A type 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide hardener.

CHEN K, YU D

Low-expansion coefficient halogen-free resin composition useful in laminate and printed circuit board, comprises e.g. o-cresol epoxy resin, bis(4-maleimidophenyl)methane, polyvalent hydroxy-modified styrene resin, phosphinate and cyanate ester hardener.

CHEN K, YU D

Halogen-free low-dielectric epoxy resin composition useful in laminated plate and printed circuit board, comprises e.g. dicyclopentadiene epoxy resin, cresol novolac epoxy resin, maleimide resin, and 9,10-dihydro-9-oxa-10-phosphaphenan-threne-10-oxide-bisphenol phenolic resin hardener.

CHEN K, YU D

Cured product used for multilayer sheet, comprises composition comprising resin or resin precursor, and filler having preset aspect ratio, and has preset thermal conductivity and elastic modulus.

KIGUCHI K, TSUCHIYA H, SHIMADA A