国家/地区 中国（7）
IPC部 C（7）
IPC大类 C08（7） C09（5） B29（2）
H05（2）
IPC小类 C08K（7）
IPC C08K003/04（4） C08L063/00（3） C08G073/10（2）
C08J005/24（2） C08J009/28（2） C08J009/36（2）
C08K007/00（2） C08L013/00（2） C08L063/04（2）
C08L067/04（2） C08L071/02（2） C08L079/08（2）
C08L083/04（2） C09K005/14（2）
发明人 CHEN C（7）
公开年 2023（7）
申请年 2023（4）  2022（3） 
专利权人 CHANGSHU SHE.（2） SHENGYI TECH.（2） UNIV JILIN（2）

Laminated waterproof and antibacterial medical packaging material comprises polycarbonate, sodium polyacrylate, isomeric tristyryl polyoxypropylene ether polymer, benzenesulfonyl chloride, N, N'-dimethylmethylene acrylamide, polyvinyl chloride, cetyltrimethylammonium bromide and polyethylene glycol.

ZHU X, CHEN C

Resin composition used for preparing low-flow glue prepreg for rigid-flexible combined printed circuit board, comprises epoxy resin, epoxy curing agent, curing accelerator, carboxy-terminated nitrile rubber, and oxazoline compound.

ZHANG W, CHEN C, HE J

Preparing three dimensional thermally conductive skeleton/polyimide thermally conductive composite material comprises subjecting thermally-conducting porous material soaked by polyamic acid solution, performing freeze drying and phase conversion treatment to thermally-conducting porous material.

CHEN C, ZHAO X, ZHOU H, ZHAO J, YANG L, WANG D

Resin composition useful in preparing low-flow adhesive prepreg comprises epoxy resin, epoxy curing agent, curing accelerator, carboxylated nitrile rubber, carbodiimide compound.

ZHANG W, CHEN C, HE J

Silicone foam sheet comprises silicone resin composition modified chitosan sol solution, where silicone resin composition includes carbohydroxy modified organopolysiloxane, epoxy resin, polylactic acid, alkyl phenol polyoxyethylene ether, sodium bicarbonate, water and zinc stearate.

CHEN C, LIN J

High ductility and high temperature resistant composite food packaging film useful for food packaging or food preserving, comprises modified composite film layer which is base modified film layer, maleic anhydride graft polyethylene resin film middle layer and polyethylene outer film layer.

CHEN C

Preparing thermally conductive filler/polyimide aerogel metallized high thermally conductive composite material, involves preparing thermally conductive filler/polyimide aerogel, electroplating aerogel material, and vacuum hot pressing.

CHEN C, ZHAO X, ZHOU H, ZHAO J, YANG L, WANG D