国家/地区 中国（35） 世界知识产权组织（3） 美国（2）
IPC部 C（39）
IPC大类 C09（39）
IPC小类 C09D（39）
IPC C09D011/03（39）
发明人 LI L（3） LI X（3） PAN Z（3）
SHAO Z（3） SUN J（3） WU B（3）
ZHENG N（3） ZHOU M（3） HUANG Y（2）
LIU J（2） LUO Z（2） MA Z（2）
WANG J（2） WANG W（2） WANG Y（2）
公开年 2022（27） 2023（12）
申请年 2022（39）
专利权人 ANHUI AEROSP.（3） TAN KAH KEE .（3） UNIV XIAMEN（3） JIANGSU DAYA.（2）
SHENZHEN LAM.（2）

Conductive ink used for preparing electroplated plastic, comprises water-based resin binder, conductive filler, swelling agent and solvent.

ZHENG N, SUN J, SHAO Z, WU B

Conductive ink used for preparing plastic material, comprises resin binder, conductive filler, pore-forming agent and solvent, where resin binder comprises epoxy resin, polyurethane, alkyd resin, silicone resin, thermosetting acrylic resin and/or thermoplastic acrylic resin.

ZHENG N, SUN J, SHAO Z, WU B

Azobin base ink comprises filter cake, varnish, mixed oil, demulsifier, Vaseline, expansion perlite powder, graphite powder, dispersant and conductive powder.

RUAN Y, LUO W

Nanoporous body composition used in composite insulator, comprises three-dimensional nanoporous structure in which nano-sized pores are formed, and two-dimensional sheet that is dispersed and positioned inside three-dimensional nanoporous structure.

OH Y S, UM M K, YI J W, JANG H K, PARK B H, LEEJINWOO, KYEONG J

Conductive ink composition useful in transparent conductive film, comprises 2,4-toluene diisocyanate, polyethylene glycol, epoxy resin, conductive carbon black, conductive graphite, curing agent, solvent, and dispersant, where epoxy resin is bisphenol-A-type epoxy resin epoxy resin.

WANG D

Heat-dissipating ink useful in manufacturing process of circuit board of electronic product, comprises ink material, graphene, carbon nanotubes and carbon black.

WU H, ZHUANG Q, LIN S

Two-photon polymerization compatible photosensitive ink or resin used in fabricated device including micro/nanoelectronic, battery, optic element, flexible electronic device, printed circuit board, and chip-scale electronic, comprises organic semiconductor, crosslinker, photoinitiator, and solvent.

ABIDIAN M R, DADRASTOUSSI O, KHORRAMI M, MAJD S

Porous conductive ink used in electroplating pretreatment technology, comprises graphene, conductive particles, binder, hydrophilic oxide, high boiling point solvent and low boiling point solvent.

ZHENG N, SHAO Z, SUN J, WU B

Nano printing and dyeing ink comprises organic pigment, binder, nano-calcium carbonate, viscosity modifier, additional material, deionized water, hot melt adhesive, gold powder, and graphene.

WU R, ZHANG M, WANG Y, FENG Z

Manufacturing flexible circuit board with electric heating patch comprises e.g. taking flexible single-sided copper clad laminate, manufacturing circuit pattern, manufacturing first solder resist ink composite graphene resin layer on positive-negative combination circuit, pre-baking, and cutting.

LEI H, ZHANG S, GE W, OU D, WU T, QIN J, PENG G, WANG W, WANG M