国家/地区 美国（8）
IPC部 B（8）
IPC大类 B82（8）
IPC小类 C08K（8）
IPC C09D163/00（8）
发明人
公开年 2021（2）
申请年 2019（2） 
专利权人

Matter composition comprises epoxy functionalized two-dimensional shaped particles comprising functionalized graphene, clays, and alumina platelets, carbon nanotubes, epoxy resin, and curing agent comprising ionic liquid, and 1-ethyl-3-methylimidazolium dicyanamide.

KALB J, IFTIME G, WEI J, PANDEY R, RAHULPANDY, JUNHUA W, JAMIKALB

Preparing nanocomposite coating composition for antenna reflector, comprises e.g. preparing polymer resin by adding hardener to epoxy resin selected upon organic synthetic compound, and preparing mixture of pure graphene and acetone solvent using ultrasonic disperser.

RAFIEE R

Aqueous protective coating system used for concrete, comprises at least one binder, water, and dispersion of two-dimensional material/graphitic nanoplatelets.

WEAVER W, CHIKOSHA L, BELL A, SHARP M, SHARPE M, SHARP M D, BELL A A

Coating used for protecting component exposed to corrosive environment, comprises epoxy phenolic resin, and graphene nanoplatelets.

POTEET S, FOLSOM M E, KAPALCZYNSKI K, FURSOAME M E

Graphene composite coating layer for coating target object surface comprises curable mixed resin consisting of curable resin and curing agent and surface-modified nano graphene sheets which are evenly spread in curable mixed resin.

WU M Y, HSIEH C, SHUI C, WU Y, XIE C, HSIEH C Y, SHUI C K

Semiconductor sealing material composition used as packaging material to protect electronic part e.g. diode comprises epoxy resin; hardener; curing catalyst; additive such as coupling agent; and nano-graphene plate powder as filler.

CHOI S, PARK S, CHOI S H, PARK S H, HONG C S, HUI P S

Nanocomposite material, useful to produce electronic device and/or structural material, comprises a substrate, optionally functionalized graphene, optional adhesive component to adhere graphene to substrate and an optional protective layer.

KINLOCH I A, YOUNG R J, NOVOSELOV K S

Resin composition for treating surface of steel sheet, comprises binder resin, graphene and solvent.

CHO J D, LEE J R, LEE J S, SHIM S E, LEE J, CHO J, SHIM S