国家/地区 中国（6）
IPC部 C（6）
IPC大类 C09（6）
IPC小类 C09D（6）
IPC C09D011/52（6）
发明人 SHAO Z（3） SUN J（3） WU B（3）
ZHENG N（3） CAO D（2） LI M（2）
LI Z（2） LIU Q（2） MA Y（2）
WU L（2） YE D（2） ZENG C（2）
公开年 2023（3） 2021（2）
申请年 2022（3）  2020（2） 
专利权人 TAN KAH KEE .（3） UNIV XIAMEN（3） GUANGDONG KO.（2）

Conductive ink used for preparing electroplated plastic, comprises water-based resin binder, conductive filler, swelling agent and solvent.

ZHENG N, SUN J, SHAO Z, WU B

Conductive ink used for preparing plastic material, comprises resin binder, conductive filler, pore-forming agent and solvent, where resin binder comprises epoxy resin, polyurethane, alkyd resin, silicone resin, thermosetting acrylic resin and/or thermoplastic acrylic resin.

ZHENG N, SUN J, SHAO Z, WU B

Porous conductive ink used in electroplating pretreatment technology, comprises graphene, conductive particles, binder, hydrophilic oxide, high boiling point solvent and low boiling point solvent.

ZHENG N, SHAO Z, SUN J, WU B

Porous titanium carbide MXene/reduced graphene oxide based wallboard comprises a bottom plate, porous titanium carbide MXene/reduced graphene oxide-based heating film and panel, the panel made of transparent material.

WU L, CAO D, MA Y, YE D, LI M, LI Z, ZENG C, LIU Q

Porous molybdenum carbide MXene/reduction graphene oxide base wall plate, comprises bottom plate, porous molybdenum MXene/reducing oxidized graphene-based heating film and panel, and electrode extends out of transparent insulating layers.

WU L, CAO D, MA Y, YE D, LI M, LI Z, ZENG C, LIU Q

Forming electroplated copper on non-metallic material surface by preparing graphene-based electroplating ink, spraying ink on surface of non-metallic material, drying, soaking material in electroplating solution and applying current.

GU G, ZHANG G, LAI Z