国家/地区 中国（5）
IPC部 C（5）
IPC大类 C25（5） C09（2） C22（2）
H01（2）
IPC小类 C25D（5）
IPC C25D007/06（5）
发明人
公开年 2021（4）
申请年 2021（5）
专利权人

Preparation of high temperature resistant copper wire includes calcining magnesium, chromium, titanium, nickel and copper to obtain metal mixture, casting metal mixture into ingot, forging ingot to strip copper core and spraying electroplated copper wire with high-temperature resistant coating.

QIAN G, XU H, SUN F, LAI S

Preparing bright high-conductivity graphene/copper complex material comprises e.g. preparing graphene/copper deposition liquid, adding gelatin and sodium dodecyl sulfate as additive, adding polyacrylamide and thiourea, and depositing.

WEI K, WANG S, WEI W, CHU F, DU Q

Processing tinned copper-clad alloy wire involves preparing alloy rod, welding copper and alloy wire to form copper-clad alloy wire blank, carrying out multiple times of small deformation drawing processing, and plating tin layer.

OUYANG Y

Electrolytic copper foil used for lithium ion battery, comprises copper, chlorine element and rare-earth element.

PENG S, LIAO P, YE M, LI Q, ZHU E, LI Y, LIU J, BANG S, LIO P Y, LEE C, MASTER S, LEE J

Method for coating hydroxy graphene modifiedelectrophoretic paint without nickel stainless steel comprises e.g. performing cathodic electrolytic activation and coating surface of nickel-free stainless steel.

LAI H, GUO C, CHEN M, CHEN K