国家/地区 中国（18） 世界知识产权组织（5）
IPC部 C（21）
IPC大类 C25（21） C23（4） C09（3）
C22（3） H01（3） B29（2）
C01（2） C21（2）
IPC小类 C25D（21）
IPC C25D015/00（21）
发明人 HU Y（3） JI S（3） LIN J（3）
LIN R（3） OTHER I R N（3） SHEN Q（3）
WANG C（3） XU Z（3） ZENG L（3）
ZHENG J（3） ZHOU J（3） DING Y（2）
LI Y（2） LIU X（2） WANG D（2）
公开年 2022（17） 2023（4）
申请年 2022（21）
专利权人 ZHEJIANG CHI.（3） STATE GRID C.（2）

Silver-graphene composite plating layer, has layer main body provided with first nano-silver layer, silver-graphene layer and second nano-silver layer that are sequentially arranged on base body.

LI H, ZHAO K, ZHANG Q, CHEN B, GUO W, ZHU Z, ZHANG C, DING Y, PANG Z

High-strength steel plate comprises base steel plate, and ferrite layer having internal oxide layer on which iron-nickel alloy layer is formed with excellent surface quality formed in internal oxide layer from surface of ferrite layer.

LEE K, LEE C, KANG K, KIM N, JANG Y, LEE J, KANG K C, KIMNAMAH, JANG Y M

Coating substrate for ion erosion resistance and passive electron emission during space weather exposure of spacecraft components, satellites, orbiting platforms, and solar arrays, involves adding ion erosion resistant particles, conductive particles, and binder to an electrophoretic solution.

INMAN M E, HALL T D, WANG D, LIU D X, RADHAKRISHNAN R

On-site repairing conductive composite plating layer of power equipment involves using electro cleaning solution and silver graphene composite plating solution as electroplating solution and subjecting surface of workpiece to electro cleaning treatment and silver-coated graphene composite treatment.

ZENG X, LIU X, JIA L, TIAN X, PEI F

Preparing graphene/copper composite material useful in field of heat conduction, comprises e.g. preparing deposition solution, polishing anode and cathode plate, removing oil stain, carrying out alternate electrodeposition and performing asynchronous rolling and recrystallization annealing.

LIU X, WANG D, AN X, WEI K, XIA C, WEI W

Electrolyte for electrodeposition of copper on semiconductor substrate, comprises copper ions, solvent, and amine that complexes copper ions and graphene.

MEVELLEC V, DOUSSOT C P, CAILLARD L

Electroplating method for non-metal plating with surface absorbed with carbon black, involves placing non-metallic plating piece with surface absorbing nano-metal conductive object in first plating liquid without forced convection to perform first-plating with first preset current density.

MIAO H, ZHU K

Packaging carrier plate has alumina ceramic plate whose one surface has three-dimensional conical structure layer of alumina ceramic, where copper-graphene composite material layer is compounded on three-dimensional conical structure layer.

LIANG N, WU S, WANG J, SUN C, ZHANG D, ZHANG W, SONG X

Composite dispersant useful in preparing mixed electroplating solution comprises distilled water, Tween composite as nonionic surfactant, hydrocarbyl sulfonate composite as anionic surfactant, and amide composite as wetting agent.

HU Y, WANG C, LIN R, JI S, XU Z, ZHOU J, ZENG L, SHEN Q, LIN J, ZHENG J, OTHER I R N

Composite dispersant useful in mixed electroplating solution, comprises distilled water, polysorbate as non-ionic surfactant and wetting agent containing hydrocarbyl sulfate compounds and hydrocarbyl sulfonate compounds.

JI S, XU Z, ZHOU J, ZENG L, SHEN Q, LIN J, ZHENG J, HU Y, WANG C, LIN R, OTHER I R N