国家/地区 中国（6）
IPC部 C（6）
IPC大类 C23（6）
IPC小类 C23C（6）
IPC C25D003/38（6）
发明人 GUO C（2） LAI H（2）
公开年 2021（4） 2022（2）
申请年 2021（6）
专利权人 GUANGZHOU UL.（2）

Heat-conducting graphene sheet filling hole copper-covering structure for use in electronic radiating field, has heat conducting graphene sheet whose upper and lower surfaces are uniformly coated with copper layer.

LIU Y, HUANG K, QIN F, WEI T

Preparing surface metal layer used in aerospace, electrical and electronic fields, involves e.g. coarsening, sensitizing and activating polyetheretherketone modified with carbon fiber, glass fiber, carbon nanotube and graphene, chemical plating and electroplating copper, and plating nickel.

ZHANG L, TONG X, WANG J, ZHANG J, WEN C, LI S, CUI Q, WANG X, XU J, FENG L, BAI J, LI J, WANG N

Composite copper foil structure used for copper-clad laminate and printed circuit board, has shell layer comprising N-layer graphene layer and M-layer metal copper layer alternately laminated with each other, and where surface of shell layer close to copper foil core layer is graphene layer.

GAO F, CAI L, ZHANG Q

High corrosion resistance zinc cobalt alloy coating structure of aluminum alloy piece, has trivalent chromium passivation layer and hydroxyl graphene sealing layer which are prepared in turn from inside to outside of substrate.

CHEN M, LAI H, GUO C

Protective layer structure for chemical nickel plating of aviation electric appliance accessory, comprises aluminum alloy base body, and chemical zinc depositing layer, pre-plating copper layer, and graphene sealing layer.

XIA L, GUO C, LAI H

Board comprises first copper foil, graphene layer and second copper foil, second copper foil is electroplated copper.

LIU K, DING Z, ZHANG Z, KOU J, HUANG Z, YUE X, CHEN Y, WANG E