国家/地区 中国（3）
IPC部 C（4）
IPC大类 C08（4）
IPC小类 C08G（4）
IPC C08L063/00（4）
发明人
公开年 2023（4）
申请年 2022（2） 
专利权人

Preparing a nano conductive adhesive useful in e.g. biological medicine, catalysis and magnetic recording material, comprises e.g. obtaining dispersion liquid one, dripping the electrolyte solution and stirring to obtain water-in-oil emulsion, mixing and dispersing to obtain dispersion liquid two.

HUANG Y, LIU L, ZHU P, LI J

Low dielectric composition useful in laminated plate of printed circuit board, comprises epoxy resin, hardener comprising flame retardant hardener and benzoxazine resin, halogen free flame retardant, accelerator, additive comprising inorganic filler, toughening agent and solvent.

YAO J, GONG J, CHEN S, TANG F

Heat dissipation adhesive sheet useful in electronic components e.g. semiconductors, or PC boards comprise metal thin film layer formed on lower surface of heat dissipation layer, and adhesive layer on metal thin film layer.

HUN L S, SONG J, KWON H J, CHOI S, YUMINSOOK, YOUK S K

Preparing nanoparticle-modified resin matrix based on direct ultrasonic dispersion method useful for resin or composite material forming, comprises e.g. adding curing agent to main resin, adding nanoparticles, immersing ultrasonic horn in resin mixture, and dispersing nanoparticles.

MA Z, FENG Z, YANG Y, LI L