国家/地区 中国（5）
IPC部 C（5）
IPC大类 C25（5）
IPC小类 C25D（5）
IPC C25D005/54（3） H05K003/42（2）
发明人 CAO X（2） MA Y（2） YE G（2）
ZHANG J（2） ZHENG K（2）
公开年 2021（5）
申请年 2020（5）
专利权人 CHINESE ACAD.（2）

Method for treating substrate surface for electroplating flexible circuit board, involves pre-washing surface of substrate to be electroplated, and coating prepared graphene dispersion liquid on pre-washed substrate surface to be electroplated to form conductive layer for direct electroplating.

ZHENG K, CAO X, YE G, ZHANG J, MA Y

Processing substrate hole comprises e.g. pre-washing substrate, soaking pre-washed substrate in prepared graphene dispersion liquid, soaking liquid in hole structure, ultrasonically treating, drying to form conductive layer for direct plating.

CAO X, ZHENG K, YE G, ZHANG J, MA Y

Device for printing circuit board by graphene, has conductive foil electrode line connected with metal foil sheet set in insulating plate assembly, and graphite sheet whose top end is connected with graphite sheet electrode line.

DU W

Preparing flame-retardant omni-directional conductive sponge material comprises placing sponge substrate into pre-soaking liquid, subjecting into electroplating solution, and plating electroplated sponge substrate with conductive cloth.

LIU W

Electroplating of metal on surface of insulating base material for printed circuit board, involves mixing resin and solid filler to obtain resin coating, coating conductive substance forming film and placing in plating solution.

LAI Z, LIANG X, ZHAO T, LIU D, SUN R