国家/地区 中国（5） 韩国（3） 美国（3） 德国（2） 英国（2） 日本（2） 台湾（2） 世界知识产权组织（2）
IPC部 B（5）
IPC大类 B32（5）
IPC小类 B32B（5）
IPC B32B009/00（4） B32B003/26（3） B32B007/12（3）
B32B009/04（3） H05K007/20（3） B32B029/00（2）
B32B033/00（2） F28F021/02（2）
发明人
公开年 2022（3） 2021（2）
申请年 2021（5）
专利权人

Thin encapsulating mounting structure for evaporation and heat dissipation applications for electronic component, has specific thin film portion whose one surface is fixed to fixing portion, and preset thin film portion, fixing portion and specific thin film portion that are assembled.

LU J, LUGECHI, LU J Q

Heat dissipation sheet comprises e.g. graphite layer, primary graphene layer stacked on one side of graphite layer with primary adhesive layer interposed there between and secondary graphene layer stacked with secondary adhesive layer.

PARK J, YOUNG C, CHOI C Y, PARK J U, CHOI C, PIAO Z

Heat storage ceramic tile, has ceramic tile main body whose top part is provided with ceramic surface skid-proof layer, and heat storage layer whose inner part provided with thermocouple and other side provided with telescopic hole.

WANG Y, ZHANG H, SHENG Y

Device for protecting body from damage, has inner assembly that is adjacent to outer protective cover and comprises thermal energy transfer device adapted to transfer thermal energy to and/or from thermal energy conduction element.

DEVINE S, CHEN S

Assembly for a battery, includes thermal management multilayer sheet equipped on surface of an electrochemical cell, and thermal management multilayer sheet comprising thermally-insulating layer.

CHURCHILL C, DAIGLE R C, KILHENNY B, DAGLE R