国家/地区 中国（4） 台湾（3）
IPC部 F（7）
IPC大类 F28（7）
IPC小类 F28D（7） F28F（4） H05K（3）
IPC F28D015/04（7）
发明人
公开年 2021（7）
申请年 2020（5）  2021（2） 
专利权人

Flat heat pipe for use in heat dissipation of high power electronic device, has graphene interconnection array arranged in silicon carbide closed flat shell and for vertically growing with microporous structure of upper and lower inner surface of contact carbide close flat shell.

ZHANG Y, ZHAO Q

Heat conductive device for use in an electronic device, such as mobile phones, comprises a heat conductive unit provided with a closed chamber, a wick structure arranged on an inner side surface of the closed chamber, and a heat conductive fluid is arranged in the closed chamber.

CHENG C, WEI S, JUANG Z, HSIEH C

Method for manufacturing thermal conductive plate, involves attaching good thermal conductor containing hydrophilic graphene to surface of reinforcing portion and/or shell to form film-like hydrophilicity adhesion layer.

WU C M

Thin-type uniform temperature plate coated with graphene, has heat absorbing plate and radiating plate that are covered with each other, where side of heat absorbing plate and radiating plate are arranged far away from groove that is sprayed with graphene layer.

CHEN X

Uniform temperature equalizing plate, has chamber filled with working liquid and heat conducting piece, where heat conducting coefficient of heat conducting piece is greater than heat conducting coefficient of first sheet body and second sheet body.

HONG Y, LI M, CHEN Y, HORNG A

System for cooling concrete roof, has coolant liquid that is provided inside hollow elongated portion, and storing unit that circulates coolant to condensing unit is configured to condense gaseous coolant liquid.

TRIJO T, LAZARUS G A

Graphene vinyl chloride soaking plate, has capillary core layer formed between upper layer plate and lower layer plate, where inner portion of lower layer plate is provided with filling chamber.

LI G, ZHANG C