国家/地区 中国（7）
IPC部 C（7）
IPC大类 C04（7） F41（4） B22（2）
F16（2）
IPC小类 C04B（7） F41H（4） B22D（2）
F16J（2）
IPC C04B035/626（7）
发明人 CUI Y（2） FANG N（2） FU S（2）
LI Q（2） XIA L（2） ZHAO L（2）
公开年 2018（2） 2021（2） 2022（2）
申请年 2017（2）  2021（2） 
专利权人 ZHEJIANG LIT.（2）

Preparing far-infrared nano ceramic powder, comprises mixing coupling agent modified far infrared nano ceramic powder dispersion with graphene slurry, freezing and drying, thermally pressing and sintering, and grinding radiating fin.

YANG X, SHAO J

Method for preparing boron carbide single board composite used in bullet-proof armor and bullet-proof plug board, involves preparing raw materials, preparing wearable powder by weighing silicon dioxide, titanium dioxide, nano thorium dioxide, and dialkyl dithiophosphate molybdenum sulfide.

LI Q, FANG J, SUN L, REN S

Preparation of magnetic mechanical seal friction pair used in mechanical sealing components, involves reacting e.g. silicon carbide micropowder, nano-carbon powder and binder, drying, pulverizing, mixing silicon particles and modified boron nitride particles, press-molding, heating, and polishing.

ZHAO Y

Preparation of boron carbide composite ceramic plate used for bullet-proof plug board, involves mixing boron carbide powder and graphene suspension, adding base material, granulating, drying, adding to graphite mold, heating, and cooling.

GAO D

Boron carbide ceramic is formed by splicing a boron carbide ceramic plate, and the boron carbide ceramic plate is formed by hot-pressing a boron carbide ceramic material that includes a boron carbide ceramic matrix and graphene.

XIA L, CUI Y, ZHAO L, FU S, FANG N

Preparation of boron carbide ceramic sheet involves adding dispersant to graphene solution, dispersing, adding boron carbide powder and graphite powder, ball milling to form slurry, granulating, drying, molding, hot-pressing and sintering.

XIA L, CUI Y, ZHAO L, FU S, FANG N

Method for producing corrosion-resistant and wear-resistant sintered silicon carbide seal, involves using silicon carbide, plasticizer, water-soluble resin, mold releasing agent, tantalum pentoxide, garnet powder and graphene.

LI Q