国家/地区 美国（4）
IPC部 C（4）
IPC大类 C08（4） C09（4） H01（3）
H05（3） B32（2）
IPC小类 C08K（4） H05K（3） B32B（2）
C08L（2） C09D（2） C09K（2）
H01L（2）
IPC C08K007/06（4）
发明人
公开年 2021（4）
申请年 2020（2） 
专利权人

Polymer composition used for forming substrate for electronic device, comprises liquid crystalline polymer, electroconductive filler, and mineral filler, and has preset surface resistivity.

KIM Y S, JIN R

Integrating process of electrically conductive material into surface layer of electrically conductive polymer, involves including an electrically conductive material in a polymerisation mixture, and polymerising polymerisation mixture.

HIGHGATE D J, HOWLIN B J, TANG W

Heat-dissipating plastic used for e.g. electronic component, comprises polymer matrix including main resin, and carbon-based filler including fibrous carbon-based filler and granular carbon-based filler, dispersed in polymer matrix.

LEE J H, LI Z

Manufacture of substrate for device for shielding electromagnetic radiation, involves providing polymer material and/or precursor comprising conductive filler, and subjecting polymer material and/or precursor to shaping with material bond.

SCHROIFF V, SUTTER M, HAUER M, GRUNE E