国家/地区 中国（8） 韩国（5）
IPC部 C（14）
IPC大类 C09（14）
IPC小类 C09J（14）
IPC H05K007/20（8） C09J011/04（7） C09J007/29（5）
H05K009/00（5） C09J007/20（3） C09J201/00（3）
C01B032/19（2） C01B032/21（2） C08K003/04（2）
C09J007/28（2） C09J007/30（2） C09J007/40（2）
H05K001/02（2）
发明人 CHOI S（3） SONG J（3） YUMINSOOK（3）
HUN L S（2） KIMTAEHAN（2） KWON H J（2）
SHIM Y（2） YOUK S K（2）
公开年 2023（14）
申请年 2021（7）  2022（7） 
专利权人 PURE MANN IN.（3）

Wave-absorbing and heat-conducting material useful in electronic component, comprises binder, tackifying resin, thickener, dispersant, agent, defoamer, wetting agent, wave-absorbing agent and heat-conducting agent.

LV G, MENG C, WANG B, YANG Y

Electronic shielding adhesive structure, has shielding adhesive device fixed between first object and second object and comprising adhesion mechanism, shielding mechanism, heat conducting mechanism and damping mechanism.

YANG S, JIN Y, ZHOU Z, LIN H

Low-density composite electromagnetic shielding plate used in electronic product comprises electromagnetic wave-absorbing foam layer arranged between two composite shield layers, and composite shielding layer, and glass fiber-reinforced epoxy insulating layer are alternately stacked.

LI H

Hot melt adhesive composition for encapsulating electronic devices, preferably located under bonnet of vehicle or in medical devices comprises at least one aliphatic semi-crystalline copolyamide and at least one thermally conductive filler.

PRENVEILLE T

Manufacturing heat dissipation sheet using graphene useful for electric or electromagnetic devices comprises preparing dispersion having graphene or graphene oxide, adsorbing metal salt to graphene or graphene oxide by adding metal salt.

JIN K

Graphene heating uniform heating film for e.g. point heating bed, has heating component whose outer side is equipped with heat conducting uniform mechanism, and outer layer group equipped with automatic packaging component.

CHAO L, BAO Y, HU H, CHEN Y, MENG K

Heat dissipation adhesive sheet comprises copper graphene composite sheet filled with crude graphene solution, where crude graphene solution is coated on copper mesh and graphene resin layer formed on graphene composite sheet.

HEE L J, HEE L Y, CHOIJINHO

Electromagnetic shielding protective film used for electronic applications, comprises metal foil layer, and conductive adhesive layers comprising organic siloxane modified acrylic ester adhesive and conductive filler, arranged on both sides of metal foil layer.

LUO X, DING Z, LIU S

Ultra-thin graphite radiating film for use in electronic device, has release material layer adhered on surface of heat-conducting adhesive layer, where surface of material layer and adhesive layer contact is provided with convex points.

JIANG D, LIU J, ZHOU E

Heat dissipation adhesive sheet useful in electronic components e.g. semiconductors, or PC boards comprise metal thin film layer formed on lower surface of heat dissipation layer, and adhesive layer on metal thin film layer.

HUN L S, SONG J, KWON H J, CHOI S, YUMINSOOK, YOUK S K