国家/地区 中国（5）
IPC部 B（5）
IPC大类 B32（5）
IPC小类 B32B（5）
IPC C08K007/14（3） C08L079/08（3） H05K001/03（3）
B32B015/14（2） B32B015/20（2） B32B017/02（2）
B32B027/04（2） B32B027/08（2） B32B027/34（2）
B32B033/00（2） C08K007/18（2） C08L063/00（2）
C08L063/04（2）
发明人 CHEN K（5）
公开年 2022（5）
申请年 2021（2）  2022（2） 
专利权人 ITEQ WUXI EL.（3）

Special plastic soft core useful for hydraulic rubber pipe production industry comprises e.g. polypropylene resin, poly-4-methyl-1-pentene resin, polyisobutylene, polyamide resin, peroxidation initiator, graphene, talc, calcium carbonate, antioxidant and thermoplastic polyester elastomer resin.

CHEN K, ZHANG Y, JIANG W

Antibacterial high barrier multi-layer co-extruded biaxially oriented polypropylene light film comprises surface layer attached to both sides of barrier layer and surface material obtained by blending and extruding styrene-butadiene-styrene block copolymer and polypropylene block copolymer.

WANG J, XIE H, LIN Y, SUN F, CHEN K

Low-expansion coefficient halogen-free resin composition useful in laminate for printed circuit board, comprises e.g. o-cresol formaldehyde epoxy resin, bismaleimide resin, cyanate ester hardener and bisphenol A type 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide hardener.

CHEN K, YU D

Low-expansion coefficient halogen-free resin composition useful in laminate and printed circuit board, comprises e.g. o-cresol epoxy resin, bis(4-maleimidophenyl)methane, polyvalent hydroxy-modified styrene resin, phosphinate and cyanate ester hardener.

CHEN K, YU D

Halogen-free low-dielectric epoxy resin composition useful in laminated plate and printed circuit board, comprises e.g. dicyclopentadiene epoxy resin, cresol novolac epoxy resin, maleimide resin, and 9,10-dihydro-9-oxa-10-phosphaphenan-threne-10-oxide-bisphenol phenolic resin hardener.

CHEN K, YU D