国家/地区 中国（3） 世界知识产权组织（3）
IPC部 B（7）
IPC大类 B29（7）
IPC小类 B29C（7）
IPC C08J005/18（7）
发明人 NAITO T（2） REN Z（2） SHIRATORI K（2）
TSUKADA Y（2） WANG H（2） YAJIMA A（2）
公开年 2022（6）
申请年 2021（7）
专利权人 GUANGDONG SU.（2） NISSAN MOTOR.（2）

Thermally conductive film for heat dissipation structure, is formed by arranging binder and scale-like carbon materials formed by graphene layers, and making portion(s) of minor axis of binder and minor axes of spaces formed by carbon materials and binder smaller than minor axis of carbon materials.

NAITO T, TSUKADA Y, KENEKO T, YAJIMA A, SHIRATORI K

Heat conductive film used for head-up display, is configured by disposing scale-like carbon material formed by graphene layers such that adjacent scale-like carbon materials contact each other, and such that major axis of scale-like carbon material is oriented in surface direction of film.

KANEKO T, NAITO T, TSUKADA Y, YAJIMA A, SHIRATORI K

Manufacture of graphene master batch used for manufacturing graphene vibration film, involves melting and mixing polymer material and graphene powder, adding additive, adding glue chain agent, and making molten raw material.

TSENG W L, CHAN C L, SHIH Y M

Nylon film used as outer resin layer for aluminum pouch film for secondary battery, comprises preset amount of carboxyl group, ketone group, and graphene including all amide functional groups on its surface.

SHIM J H, UK C S, PAKSUNGIL, JANG P G, LEE S, CHUN S W, PARK S I, LEE S S

Preparing silicone rubber electromagnetic shielding complex material with three-layer structure comprises e.g. mixing raw silicone rubber, 2,5-dimethyl-2,5-bishexane, zinc oxide, stearic acid, and white carbon black, cutting into sheets, adhering all sheets, hot pressing, and curing.

JI Z, ZHANG M, MA J, LI X, ZHANG T, SHAO L

Preparing oriented thermally conductive sheet, comprises e.g. placing prepared fluid composition in orientation molding device, applying high-speed shearing force layer by layer and orienting thermally conductive filler to form continuous multi-layer assembly, then thermally curing, and slicing.

HE C, LIAO X, WANG H, WU P, REN Z

Preparing directional heat conducting sheet used for semiconductor radiating device, by placing fluid composition in orientation forming device, applying high-speed shear force, orienting filler in composition in shear direction to form thin-layer composition, collecting in mold, curing and slicing.

REN Z, WANG H, REN Z M