国家/地区 中国（5）
IPC部 C（5） H（2）
IPC大类 C08（5）
IPC小类 C08J（5） C08L（5） C08G（2）
C08K（2） C09D（2） H05K（2）
IPC C08L079/08（5）
发明人 LIANG X（5）
公开年 2022（3）
申请年 2021（2） 
专利权人 ENANO SHENZH.（3）

Low-dielectric heat-conducting polyimide film comprises raw materials comprising dianhydride monomer, diamine monomer, solvent B, heat conducting filler, coupling agent, auxiliary agent and solvent A.

LAI Z, FENG L, TU Y, LIANG X, LIU Z, ZHU X

High heat-conducting polyimide film with good film-forming properties comprises aromatic diamine monomer, aromatic dianhydride monomers, heat-conducting filler, film-forming auxiliary materials and polar solvents.

LI X, LAI Z, FENG L, LIANG X, LIU Z, ZHU X

Semi-cured polyimide sheet capable of heat pressing and resistant to high temperature comprises heat conducting filler, a semi-curable resin, a curing agent, an accelerator, zirconium beads, polyimide film, polyimide film and polyethylene terephthalate film.

LAI Z, FENG L, TU Y, LIANG X, LIU Z, ZHU X

Electroplating of metal on surface of insulating base material for printed circuit board, involves mixing resin and solid filler to obtain resin coating, coating conductive substance forming film and placing in plating solution.

LAI Z, LIANG X, ZHAO T, LIU D, SUN R

Composite film comprises substrate film composed of graphene, high molecular polymer, curing agent and coating layer.

SUN R, YE H, ZHAO T, ZHANG B, HU Y, LIANG X