国家/地区 中国（7）
IPC部 C（7） H（2）
IPC大类 C08（7）
IPC小类 C08G（7） C08J（4） C08K（4）
C08L（4） C01B（2） C09D（2）
IPC C08G073/10（7）
发明人 ZHANG B（7）
公开年 2022（3） 2017（2）
申请年 2020（3） 
专利权人 ZHUZHOU TIME.（3）

High wear-resistant type polyimide enamel wire coating used in e.g. electronic electric, comprises fluorine-containing polyimide, nano silicon dioxide, polydimethylsiloxane, modified graphene, and nano-calcium carbonate.

YE H, WANG S, ZHANG F, ZHANG B

Manufacture of high heat-resistant ultra-low expansion polyimide film for e.g. electronics, microelectronics , optical display or optical communication field, by mixing raw material with solvent, filtering, vacuum defoaming, uniformly coating, and peeling substrate.

QIAN X, LIAO B, ZHANG B

Preparing high temperature resistant polyimide useful for manufacturing flexible display substrate, comprises e.g. carrying out suction filtration and vacuum defoaming of polyamic acid resin solution, casting on casting plate, solidifying into adhesive film.

QIAN X, LIAO B, ZHANG B

New low-dielectric polyimide useful in preparation of low-dielectric polyimide film for electronic packaging.

QIAN X, LIAO B, ZHANG B

Preparing heat dissipation film based on large-diameter graphene oxide comprises e.g. stirring modified graphene oxide, modified boron nitride, modified carbon nanotube and solvent into reactor, reacting and casting polycondensate into film.

CUI J, XU P, LI Y, ZHANG B

Preparing fluorinated graphene/polyimide enameled wire involves carrying out polymerization on diamine, dianhydride and fluorinated graphene, and soaking copper wire in synthesized fluorinated graphene/polyamic acid solution.

HE D, ZHANG B

Preparation of highly thermally conductive graphite film, involves adding graphene to strongly polar organic solvent, ultrasonically dispersing, adding diamine and dianhydride to graphene dispersion, and stirring.

GAO J, LIU Y, PENG B, JIANG Q, ZHANG B, YANG J