国家/地区 中国（76） 世界知识产权组织（6） 美国（3） 韩国（2）
IPC部 C（80） B（7） H（7）
G（4） F（3） A（2）
IPC大类 C08（80）
IPC小类 C08K（80）
IPC C08K003/08（80）
发明人 CHEN Y（4） XU J（4） ZHANG L（4）
GUO Y（3） HUANG Z（3） LI J（3）
SUN R（3） XIAO J（3） ZENG X（3）
ZHANG C（3） ZHANG W（3） ZHANG X（3）
ZHANG Y（3） AN D（2） CHEN J（2）
公开年 2021（21） 2018（16） 2022（12） 2017（10） 2016（7） 2020（6） 2019（4）
申请年 2020（16）  2017（13）  2018（10）  2019（9）  2021（9）  2022（9）  2016（6）  2015（5）  2013（2） 
专利权人 HUANG Z（3） SHENZHEN INS.（3） UNIV SICHUAN（3） HEZHOU BAOXI.（2）
SHANGHAI ALL.（2） SHENZHEN FRD.（2） STATE GRID C.（2） TONGLING TON.（2）
UNIV SHANGHA.（2）

Electronic device such as chip, comprises electronic component, heat sink in which surface its is provided with magnetic layer containing permanent magnetic material, and composite thermal-conductive material comprising organic matrix and ferromagnetic particles.

FANG H, XU Y, ZHENG K

Flexible heat-conducting pad comprises liquid metal, solid heat-conducting filler and polymer, and is prepared by pouring liquid metal int polymer, stirring under air environment, dispersing liquid metal uniformly in polymer, and adding solid heat conducting filler into polymer.

CAO B, ZHANG X

Preparing porous framework with double interlaced network used as heat conductive filler in heat interface material by mixing filler, binder and water, ball milling, placing polytetrafluoroethylene mold on copper column, adding porous framework and filler mixture, filtering, drying and sintering.

XU J, SUN R, ZENG X, YAO Y

Preparing graphene heat conduction insulation master batch comprises performing expandable heat preservation treatment on expandable graphite, mixing with polycarbonate master batch, performing heat treatment, mixing graphene modified master batch and conductive powder, extruding and granulating.

CHENG Y, CHENG C, ZHOU X, LI D

Graphene-modified polyvinylidene fluoride based on silver modification is characterized in that it is polyvinylidene fluoride modified with silver nanoparticles supported on graphene.

CHEN J, ZHOU H, YE K, WANG C, WANG X, XU Z, BAI J, MAO C

Heat-conducting and wave-absorbing nano-grade composite material for function-wide frequency spectrum, comprises heat conducting alumina powder, absorbing powder, medium ceramic powder, graphene, cross-linking agent, curing agent, catalyst, curing delay agent and rest of silicone oil carrier.

DENG S

High-efficiency and thermal conductive silicone grease comprises silver paste, diamond powder, graphene, polydimethylsiloxane, zinc oxide, aluminum oxide, silicon oxide, wt. boron nitride, silicon carbide, and aluminum powder.

LIU M

Non-wax phase change thermally conductive sheet includes polymer matrix, thermally conductive filler, coupling agent, diluent, tackifier and adjuvant.

LONG X

High-temperature resistant heat-conducting wave absorbing plate comprises liquid silicone rubber, cross-linking agent, platinum catalyst, inhibitor, heat conducting powder, and absorbing powder.

LI J, ZHOU C

Preparing low-contact thermal resistance phase change trigger type thermal interface material involves utilizing thermoplastic elastomer, phase change microcapsule of nano heat conducting filler/phase change material and micron size heat conducting filler.

SUN K, FENG C