国家/地区 美国（5） 中国（4） 韩国（3） 世界知识产权组织（3） 欧洲专利局（EPO）（2） 日本（2）
IPC部 C（6） B（2） H（2）
IPC大类 C08（6）
IPC小类 C08K（6） C08L（4） C08G（3）
C08F（2） C08J（2） C09D（2）
H01B（2）
IPC C08K003/105（6）
发明人 IGUCHI H（2） KASHIWAGI T（2） TSUTSUMI Y（2）
公开年 2022（4） 2021（2）
申请年 2020（2）  2021（2）  2022（2） 
专利权人 SHINETSU CHE.（2）

Paste for reference electrode used in biosensor, comprises mixture of silver chloride powder and carbon-based conductive material.

KANG Y J, JEONG I S, PARK C H, KIM S J, PARK Y B, PARK Y, KIM S, PARK C, JEONG I, KANG Y, CHONG I, JUN K S, CHEON I S

Producing maleimide resin film used in flexible printed-wiring boards, involves applying maleimide composition in fluid form to form shape of film, and volatilizing organic solvent from the maleimide composition to obtain the maleimide resin film which is solid and uncured resin film.

KASHIWAGI T, TSUTSUMI Y, IGUCHI H

Fusion welding polymer composition for use in high efficiency fusion or laser welding of polymer, comprises polymer in polymer matrix and graphene dispersed homogeneously and encapsulated within polymer matrix, where fusion welding polymer composition further comprises graphene, and additive.

HEPBURN D S, MICHAILIDIS M, COTTON G M J, TAYLOR C, JEFFS S R

Multilayered flexible package useful in packaging systems for food, cosmetic, nutraceutical or pharmaceutical products, comprises polymeric coating comprising dispersion of antioxidant particles.

RIVA M, VACCA P, FIDECKA K, FIDECA C

Maleimide resin film used in maleimide resin composition and as adhesive resin film having low dielectric property, comprises maleimide, (meth)acrylate, inorganic particles with respect to whole resin film and curing catalyst.

IGUCHI H, TSUTSUMI Y, KASHIWAGI T, DI J

Conductive material used in electronic device, comprises first component, where first component comprises liquid metal with melting point below room temperature, coating material and first solvent, and second component.

DONG S