国家/地区 中国（3） 美国（3） 日本（2） 韩国（2）
IPC部 C（4）
IPC大类 C08（4）
IPC小类 C08K（4）
IPC C08K003/11（4）
发明人 IGUCHI H（2） KASHIWAGI T（2） TSUTSUMI Y（2）
公开年 2021（3）
申请年
专利权人 SHINETSU CHE.（2）

Producing maleimide resin film used in flexible printed-wiring boards, involves applying maleimide composition in fluid form to form shape of film, and volatilizing organic solvent from the maleimide composition to obtain the maleimide resin film which is solid and uncured resin film.

KASHIWAGI T, TSUTSUMI Y, IGUCHI H

Additively manufacturing silicone elastomer article by applying additive manufacturing material on substrate and forming layer by addition-crosslinking electro-conductive silicone composition containing e.g., organopolysiloxane and catalyst.

YUE Y, JIA L

Quantum dot diffusion plate comprises polystyrene, polycarbonates, and/or polymethyl methacrylate plastic particles quantum dot additive molded in an extrusion molding machine and composed of quantum dots covered with graphene.

CAI W

Maleimide resin film used in maleimide resin composition and as adhesive resin film having low dielectric property, comprises maleimide, (meth)acrylate, inorganic particles with respect to whole resin film and curing catalyst.

IGUCHI H, TSUTSUMI Y, KASHIWAGI T, DI J