国家/地区 中国（4）
IPC部 C（4）
IPC大类 C08（4）
IPC小类 C08K（4） C08L（4） C09K（2）
IPC C08K003/38（4）
发明人 CHU W（2） DING S（2） JIANG N（2）
LI M（2） LIU Z（2） YU J（2）
ZHOU X（2）
公开年 2017（2）
申请年
专利权人 NINGBO INST MATERIALS TECHNOLOGY ENG C（4）

Thermally conductive gasket used in electronic device, has adjacent thermally conductive fillers in direct contact to form a three-dimensional thermally conductive network containing internal voids and inner voids of three-dimensional thermally conductive network filled with high molecular polymers.

JIANG N, LIN Z, CHU W, DAI W, LI M, YU J

Preparation of heat conducting gasket used for electronic products by mixing phase change material, heat conducting filler, matrix material and crosslinking agent, performing curing crosslinking reaction, and freezing preform.

CHU W, JIANG N, LI M, YU J

Preparing graphene-based thermally conductive interface material comprises mixing graphene material, vinyl silicone rubber, hexagonal boron nitride, vinyl silicone oil and first silane coupling agent, compressing, rolling and cutting.

DING S, ZHOU X, LIU Z

Preparation of graphene-based thermally conductive silica gel, involves immersing surface-modified organic porous polymer in graphene slurry, sintering to obtain porous composite material, mixing with silica gel and curing.

MA J, ZHOU X, LIU Z, DING S, LIU D