国家/地区 中国（528） 世界知识产权组织（11） 韩国（8） 美国（8） 日本（5） 德国（3） 台湾（3）
IPC部 C（544） B（90） H（59）
A（15） D（15） F（13）
G（6） E（5）
IPC大类 C08（544）
IPC小类 C08K（544）
IPC C08K003/38（544）
发明人 LI X（20） LI J（16） ZHANG J（16）
ZHANG Y（16） LIU Y（15） WANG J（13）
LI Y（12） WANG Y（12） ZHANG X（12）
ZHENG Y（12） DUAN X（11） LI Z（10）
LIU S（10） WANG H（10） XU J（10）
公开年 2021（131） 2022（123） 2018（68） 2017（63） 2023（53） 2020（38） 2016（31） 2019（15） 2015（14） 2014（6） 2013（2）
申请年 2022（127）  2021（108）  2020（80）  2017（61）  2016（59）  2018（39）  2019（36）  2015（17）  2014（9）  2013（4）  2023（4） 
专利权人 GUANGDONG NA.（11） UNIV SHANGHA.（9） UNIV SICHUAN（7） UNIV SOUTH C.（6）
GUANGDONG SU.（4） GUANGXI FENG.（4） NINGBO INST .（4） SHANGHAI ALL.（4）
SUZHOU RUITE.（4） UNIV GUANGDO.（4） UNIV NORTH C.（4） YE W（4）
CHINESE ACAD.（3） ENN GRAPHENE.（3） GUANGXI ZHUM.（3） HUAWEI TECHN.（3）
LIAONING LAN.（3） SHENHUA TECH.（3） UNIV ANHUI（3） UNIV BEIJING.（3）

Resin composition for semiconductor package, comprises resin composition comprising resin and filler provided in resin, where resin includes soluble liquid crystal polymer resin, where soluble liquid crystal polymer resin includes an organic soluble liquid crystalline aromatic polyester.

HWANG M Y, KIM H S, LEE K E, LEE G E, KIM H

Preparing chitosan modified boron nitride and graphene fiber composite material useful for thermal conductivity modification of epoxy resin, comprises e.g. dissolving chitosan in acetic acid solution, adding phytic acid solution containing choline chloride, adding boron nitride and centrifuging.

ZHANG Q, WANG S

Heat dissipation film has two-dimensional heat conduction elements assembled in orientation, and is prepared by dispersing two-dimensional heat conduction elements and gel components in water, placing planar substrate that can release charged particles in assembly liquid, and assembling element.

GAO W, ZHAO N, WU Y, BAI H

Preparing high thermal conductivity and low dielectric epoxy composite material used in electronic packaging field, involves preparing polyimide, dispersing polyimide microspheres and low-dimensional thermally conductive insulating fillers in solvent, mixing polyimide microsphere with epoxy resin.

ZHONG R, LIANG J, CAI H, TU S, HU D

Method of using two-dimensional filler for promoting orientation of one-dimensional fillers in cell walls of foamed material comprises e.g. melt-blending one-dimensional nano filler and two-dimensional nanometer filler with the polymer matrix material, and foaming molded body by high-pressure fluid.

CHEN D, GONG P, MA H, LI G

Antibacterial sheet used for furniture surface finishing applications, comprises substrate layer, and UV coating layer, in which graphene mixture of graphene produced by mechanical exfoliation method and hexagonal boron nitride is dispersed.

YOUNGSOOSHIM

Use of substance containing liquid metal as surface modifier for improving dispersibility of filler in polymer matrix, improving dielectric constant of filler, and improving filler electromagnetic shielding performance.

WU D, CHEN F, ZHANG Q, WU K, XIE Z, FU Q

Preparing modified polytetrafluoroethylene composite material comprises pre-treating polytetrafluoroethylene particle and heat conducting filler, mixing modifying agent, filler solution and polytetrafluoroethylene powder, extracting, drying modified solution, collecting modified powder and sintering.

YANG C

Preparing continuous fiber reinforced aromatic polyimide 3D printing thermal conductive composite material comprises e.g. impregnating continuous fiber filaments or tapes in aromatic polyimide prepolymer/thermal conductive filler, adjusting glue content and ribbon shape, curing resin.

LIU S, ZHAO J, LI L, YUAN Y

High temperature resistant lightweight thermoplastic elastomer material used for aerospace, and cable application, comprises PTFE, hollow glass microspheres, expandable microspheres, foam masterbatch, antioxidant, stabilizer, blending agent, graphene, dispersant, lubricant, and coupling agent.

LI T, LIU Y, ZHONG R