国家/地区 中国（8）
IPC部 C（8） H（2）
IPC大类 C08（8）
IPC小类 C08K（8）
IPC C08K009/06（8）
发明人
公开年 2022（4） 2023（4）
申请年 2022（8）
专利权人

Preparing high thermal conductivity insulating polyvinyl butyral intermediate film, comprises e.g. adding few-layer graphene and dispersant into solvent, using high-shear equipment to stir, adding hexagonal boron nitride, silane coupling agent hydrolysis liquid, and polyvinyl butyral, and stirring.

BOHM S, XIAO F, LIU S, QIAO S, RONG C, FENG D

Heat-conducting gel used for heat dissipation of electronic device, comprises silicone oil matrix, bisphenol-A-type epoxy resin and heat-conducting filler comprising modified graphene, modified diamond and modified carbon nanotubes, where surface of modified graphene is modified with amino group.

HE Y, LIU F, YU G

High thermal conductivity composition useful for preparation of thermally conductive materials, comprises grafted resin, curing agent e.g. cetyl ammonium bromide, thermally conductive filler e.g. aluminum oxide and modified graphene oxide.

YANG X, WAN F, TAN P

Graphene thermally conductive silicone oil useful for high-power LEDs, comprises activated graphene, aqueous ammonia, coupling agent, ethanol, dimethicone and wetting agent.

ZHONG Z, WANG Q, XIAO X

Modified graphene material useful in thermally conductive composite gasket, comprises graphene and halo-containing silane structural units present on at least part of the surface of the graphene.

HE X, HUANG Y, LI Z, DING K, ZHAO X, WANG X

Composite powder for heat dissipation coating, includes graphene and silicon dioxide microsphere, where graphene and silicon dioxide microsphere are combined together through chemical bond, graphene has preset average transverse size, and silicon dioxide microsphere has preset particle size.

HE P, DING G, ZENG X

Preparing thermally conductive filler for highly thermally conductive elastomer comprises e.g. adding composite thermally conductive material and grafted graphene oxide to mixed solvent of ethanol and water, ultrasonically dispersing, grinding, transferring to reaction vessel, and precipitating.

LIU Y, ZHONG R, LI T

Preparing graphene fiber thermally conductive gasket used in electronic device, comprises modifying graphene fibers with coupling agent, and then mixing with matrix resin and curing agent to prepare.

XIAO W, DU Y, ZHAO L, WANG Z, CAI J