国家/地区 韩国（4）
IPC部 C（4）
IPC大类 C08（4）
IPC小类 C08K（4）
IPC C08K003/04（4）
发明人 CHI S（2） JI S Y（2） KIM S（2）
KIM S H（2）
公开年
申请年 2012（2） 
专利权人 SAMSUNG ELEC.（2）

Molding composition for a semiconductor package comprises a liquid crystal thermosetting polymer resin and graphene oxide.

JI S Y, KIM S H, CHI S, KIM S

Insulating layer composition for use in substrate of insulating prepreg or insulating film and printed circuit board, comprises soluble type liquid crystal thermosetting oligomer, metal alkoxide compound, and graphene oxide.

JI S Y, HAM S J, KIM S H, KIM D Y, YEONG J S, JIN H S, HWAN K S, YEONG K D, CHI S, KIM S, KIM D, HAM S, CHI S Y, HAMSUKJIN

Semiconductor sealing material composition used as packaging material to protect electronic part e.g. diode comprises epoxy resin; hardener; curing catalyst; additive such as coupling agent; and nano-graphene plate powder as filler.

CHOI S, PARK S, CHOI S H, PARK S H, HONG C S, HUI P S

Conductive material e.g. transparent conductive electrode for touchscreen or LCD display, comprises assemblage of graphene sheets interconnecting electrically in discrete transparent layer, which has area of greater than specified value.

HAMILTON J, STREICH P, HAEMILTEON J, SEUTEURECHI P, STREICH P V, HAMILTON J P